Inventor
WEI-CHEN CHU
Inventor
TW
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
G11CStatic stores7%
H10BElectronic memory devices7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
12,575,397Metal lines of hybrid heights202612,300,600Semiconductor device with self-aligned conductive features202512,230,534Semiconductor device and method of manufacture202512,183,671Hybrid metal line structure202412,094,816Semiconductor structure having deep metal line and method for forming the semiconductor structure202412,058,852Semiconductor device and method of operating the same202412,002,709Interconnect structure and manufacturing method for the same202411,860,550Multi-metal fill with self-aligned patterning and dielectric with voids202411,764,106Semiconductor device and method of manufacture202311,729,969Semiconductor device and method of operating the same202311,682,618Hybrid metal line structure202311,422,475Multi-metal fill with self-aligned patterning and dielectric with voids202211,404,367Method for forming semiconductor device with self-aligned conductive features202211,183,422Semiconductor structure and method for manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 14 | 2021–2026 |