Inventor

Samuel George Mallinson

Inventor
Balmain, AU

Overview

106→
Patents
2005–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 106 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary
B41JTypewriters40%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure29%
B60CVehicle tyres24%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
Y10TTechnical subjects covered by former us classification3%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
10,870,287Method of inkjet printing with air-dampening of ink pressure fluctuations202010,850,508Modulation of vortex oscillations in inkjet system using synthetic jets202010,639,903Ink regulator tank for use with degassed inks202010,589,537Inkjet printhead having flared outlets202010,427,414Ink tank for regulating ink pressure201910,399,354Inkjet printhead having printhead chips attached to truss structure201910,384,461Inkjet printhead having braced longitudinal channel201910,350,903Inkjet printhead having truss structure with bracing ribs201910,131,155Inkjet printhead with butting printhead chips attached to common support web201810,081,197Inkjet printhead with transverse ribs across fluid channel having tapered heights201810,071,561Inkjet printhead having wide fluid outlets relative to printhead chip width201810,071,562Inkjet printhead having recessed transverse ribs across fluid channel201810,071,560Inkjet printhead with flexible film compliance over fluid outlets201810,035,357Inkjet printhead with bubble-venting cavities offset from fluid outlets20189,950,528Inkjet printhead with air cavities defined by ribs protruding into fluid channel20189,950,527Inkjet printhead having laterally flared fluid outlets20189,186,893'Inkjet nozzle device configured for venting gas bubbles'20159,050,797'Inkjet nozzle device configured for venting gas bubbles'20158,556,390'Inkjet nozzle assembly having suspended beam heater element offset from nozzle aperture'20138,523,143'Detachable fluid coupling for inkjet printer'20138,500,244'Printhead support structure with cavities for pulse damping'20138,382,243'Printer with reduced vortex oscillation in print gap'20138,356,885'MEMS fluid sensor'20138,342,657'Inkjet nozzle assembly having heater element bonded to chamber wall via dielectric layer'20138,322,205'Method of fabricating a integrated pressure sensor'20128,065,918'Air pressure sensor with temperature compensation'20118,025,383'Fluidically damped printhead'20118,020,965'Printhead support structure with cavities for pulse damping'20117,980,139'Miniature pressure sensor assembly'20117,980,674'Printhead incorporating pressure pulse diffusing structures between ink chambers supplied by same ink inlet'20117,980,665'Printhead assembly with an extrusion for housing bus bars'20117,967,419'Ink jet printhead incorporating heater element proportionally sized to drop size'20117,942,500'Printhead with flex PCB bent between contacts and printhead IC'20117,934,427'Capacitative pressure sensor'20117,921,725'Pressure sensor with dual chamber cover and corrugated membrane'20117,913,567'Temperature compensating pressure sensor having corrugated active membrane'20117,901,056'Printhead with increasing drive pulse to counter heater oxide growth'20117,891,764'Printhead assembly with sandwiched power supply arrangement'20117,878,067'Temperature compensating pressure sensor'20117,874,646'MEMS bubble generator incorporating superalloy heater in direct contact with bubble formation liquid without intervening protective coating'20117,857,427'Inkjet printhead having MEMS sensors for directionally heated ink ejection'20107,854,170'Capacitance sensing circuit for membrane pressure sensor'20107,854,171'Temperature compensated miniature pressure sensor'20107,841,238'Pressure sensor with temperature compensation'20107,837,297'Printhead with non-priming cavities for pulse damping'20107,819,507'Printhead with meniscus anchor for controlled priming'20107,798,608'Printhead assembly incorporating a pair of aligned groups of ink holes'20107,784,915'MEMS device with nanocrystalline heater'20107,780,271'Printhead with heaters offset from nozzles'20107,780,278'Ink coupling for inkjet printer with cartridge'20107,771,034'Fluidic arrangement with a sump for a printer'20107,770,441'Acceleration insensitive pressure sensor'20107,758,177'High flowrate filter for inkjet printhead'20107,739,916'Gas pressure sensor with temperature compensation'20107,721,441'Method of fabricating a printhead integrated circuit attachment film'20107,677,702'Inkjet printhead comprising bonded heater element and dielectric layer with low thermal product'20107,669,996'Inkjet printer with elongate array of nozzles and distributed pulse dampers'20107,654,645'MEMS bubble generator'20107,654,640'Printhead with drive circuitry components adjacent the printhead IC'20107,644,621'Capped and chambered pressure sensor'20107,637,593'Printhead with low viscous drag droplet ejection'20097,617,734'Pressure sensor with dual chamber cover'20097,581,447'Temperature compensating pressure sensing arrangement'20097,568,395'Pressure sensor with dual chambers'20097,549,328'Method of fabricating a pressure sensor'20097,549,342'Capacitative pressure sensor for oxidative environments'20097,533,573'Pressure sensor including temperature adjustment'20097,516,669'Capacitance sensing circuit for a pressure sensor'20097,475,976'Printhead with elongate array of nozzles and distributed pulse dampers'20097,464,599'Temperature compensating pressure sensor having active and reference membranes'20087,464,598'Method of pressure sensing with a pressure sensor having a sensor membrane and a compensation membrane'20087,461,558'Capacitive pressure sensor with sealed reference chamber'20087,458,272'Capacitative pressure sensor with ceramic membrane'20087,448,729'Inkjet printhead heater elements with thin or non-existent coatings'20087,438,390'Printhead module assembly with A flexible PCB'20087,430,919'Capacitive pressure sensor with reference chamber'20087,419,249'Inkjet printhead with low thermal product layer'20087,380,460'Dual wafer pressure sensor'20087,367,235'Thermal expansion compensated pressure sensor'20087,364,265'Printhead with enhanced ink supply to elongate printhead IC ends'20087,350,417'Pressure sensor with conductive laminate membrane'20087,334,876'Printhead heaters with small surface area'20087,334,480'Dual membrane sensor for temperature compensated pressure sensing'20087,328,978'Printhead heaters with short pulse time'20087,260,995'Pressure sensor having thin pressure sensing membrane'20077,261,394'Inkjet nozzle with reduced fluid inertia and viscous drag'20077,260,993'Pressure sensor with low sensitivity to acceleration forces'20077,258,020'Pressure sensor with conductive ceramic membrane'20077,258,019'Pressure sensor for high acceleration environments'20077,240,560'Pressure sensor with remote power source'20077,234,357'Wafer bonded pressure sensor'20077,222,538'Fluid permeable membrane sensor'20077,194,901'Pressure sensor with apertured membrane guard'20077,171,855'Sensor for sensing temperature adjusted fluid pressure'20077,165,460'Temperature compensated pressure sensor'20077,159,467'Pressure sensor with conductive ceramic membrane'20077,147,306'Printhead nozzle with reduced ink inertia and viscous drag'20067,143,652'Pressure sensor for high acceleration environment'20067,137,302'Capacitative pressure sensor with transition metal nitride electrode'20067,124,643'Pressure sensor with non-planar membrane'20067,121,145'Capacitative pressure sensor'20067,093,494'Micro-electromechanical pressure sensor'20067,089,790'Pressure sensor with laminated membrane'20067,089,797'Temperature insensitive pressure sensor'20067,089,798'Pressure sensor with thin membrane'20066,968,744'Capacitative pressure sensor with close electrodes'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2012Patents assigned to SILVERBROOK RES PTY LTD (82)· patent assignee history
2005–2013Based in Balmain, AU· patent location history
2011–2013Patents assigned to MALLINSON SAMUEL GEORGE (8)· patent assignee history
2011–2013Patents assigned to SILVERBROOK KIA (7)· patent assignee history
2013Patents assigned to ZAMTEC LTD (6)· patent assignee history
2015–2020Patents assigned to MEMJET TECHNOLOGY LTD (18)· patent assignee history
2015–2020Based in North Ryde, AU· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SILVERBROOK RES PTY LTD822005–2012
MEMJET TECHNOLOGY LTD182015–2020
MALLINSON SAMUEL GEORGEself82011–2013
SILVERBROOK KIA72011–2013
ZAMTEC LTD62013
Locations
LocationPatentsSpan
Balmain, AU882005–2013
North Ryde, AU182015–2020