Inventor
Tomoya Oohiraki
Inventor
Kitamoto, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
C04BLime, magnesia22%
H05KPrinted circuits11%
B23KSoldering or unsoldering7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
PatentTitleYear
10,607,915Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device202010,453,772Heat-sink-attached power-module substrate and power module201910,211,068Power-module substrate with cooler and method of producing the same201910,068,829Power-module substrate unit and power module201810,032,648Method of manufacturing power-module substrate with heat-sink20189,837,363Power-module substrate unit and power module20179,579,739'Manufacturing method of power-module substrate'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to MITSUBISHI MATERIALS CORP (7)· patent assignee history
2017–2020Based in Kitamoto, JP· patent location history
2018–2019Based in Saitama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI MATERIALS CORP | 7 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kitamoto, JP | 5 | 2017–2020 |
| Saitama, JP | 2 | 2018–2019 |