Inventor
Feng-Chang Tu
Inventor
Taipei, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1056%
H05KPrinted circuits33%
B23KSoldering or unsoldering11%
PatentTitleYear
6,567,270'Semiconductor chip package with cooling arrangement'20036,499,648'Method and device for making a metal bump with an increased height'20026,390,356'Method of forming cylindrical bumps on a substrate for integrated circuits'20026,358,834'Method of forming bumps on wafers or substrates'20026,274,491'Process of manufacturing thin ball grid array substrates'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2003Patents assigned to ORIENT SEMICONDUCTOR ELECT LTD (5)· patent assignee history
2001–2003Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ORIENT SEMICONDUCTOR ELECT LTD | 5 | 2001–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 5 | 2001–2003 |