Inventor
Abbas Guvenilir
Inventor
Seattle, WA, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing29%
H04LTransmission of digital information, e.g. telegraphic communication21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
PatentTitleYear
11,042,418Classification based automated instance management202110,191,781Classification based automated instance management20199,575,812'Classification based automated instance management'20179,465,907'Multi-polygon constraint decomposition techniques for use in double patterning applications'20166,573,173'Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process'20036,444,569'Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process'20026,274,478'Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2003Patents assigned to MOTOROLA INC (3)· patent assignee history
2001–2003Based in Round Rock, TX, US· patent location history
2016Patents assigned to GLOBALFOUNDRIES INC (1)· patent assignee history
2016Based in Gansevoort, NY, US· patent location history
2017–2021Patents assigned to SERVICENOW INC (3)· patent assignee history
2017–2021Based in Seattle, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 3 | 2001–2003 |
| SERVICENOW INC | 3 | 2017–2021 |
| GLOBALFOUNDRIES INC | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seattle, Washington, US | 3 | 2017–2021 |
| Round Rock, Texas, US | 3 | 2001–2003 |
| Gansevoort, New York, US | 1 | 2016 |