Inventor
Ji Young Chung
Inventor
Gyeonggi-do, KR
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices25%
G06KGraphical data reading6%
G06VImage or video recognition or understanding6%
H05KPrinted circuits5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B23KSoldering or unsoldering3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
A47GHousehold or table equipment1%
PatentTitleYear
10,707,181Semiconductor device with redistribution layers formed utilizing dummy substrates202010,672,676Sensor package and manufacturing method thereof202010,600,755Method of manufacturing an electronic device and electronic device manufactured thereby202010,446,455Fingerprint sensor and manufacturing method thereof201910,297,515Fingerprint sensor and manufacturing method thereof201910,224,218Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure201910,177,117Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure201910,090,230Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate201810,062,626Semiconductor device and manufacturing method thereof20189,984,947Fingerprint sensor and manufacturing method thereof20189,922,919'Electronic package structure having insulated substrate with lands and conductive patterns'20189,911,685'Land structure for semiconductor package and method therefor'20189,744,070'Snoring prevention device'20179,728,476'Fingerprint sensor and manufacturing method thereof'20179,552,999'Packaged electronic device having reduced parasitic effects and method'20179,543,235'Semiconductor package and method therefor'20179,513,254'Microfluidic sensor package structure and method'20169,418,942'Semiconductor device'20169,412,729'Semiconductor package and fabricating method thereof'20169,293,398'Land structure for semiconductor package and method therefor'20169,184,148'Semiconductor package and method therefor'20158,729,710'Semiconductor package with patterning layer and method of making same'20147,956,453'Semiconductor package with patterning layer and method of making same'20117,906,855'Stacked semiconductor package and method of making same'20117,859,107'Solder attach film and assembly'20107,847,398'Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing'20107,723,852'Stacked semiconductor package and method of making same'20107,718,523'Solder attach film and method of forming solder ball using the same'20107,170,183'Wafer level stacked package'20077,145,251'Colored conductive wires for a semiconductor package'20066,888,242'Color contacts for a semiconductor package'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2020Patents assigned to AMKOR TECHNOLOGY INC (30)· patent assignee history
2005–2010Based in Kyungki-do, KR· patent location history
2010–2014Based in Gunpo-si, KR· patent location history
2014Patents assigned to CHUNG JI YOUNG (1)· patent assignee history
2014Patents assigned to KIM BONG CHAN (1)· patent assignee history
2014Patents assigned to KIM DO HYEONG (1)· patent assignee history
2015–2020Based in Gyeonggi-do, KR· patent location history
2016–2020Based in Seongnam-si, KR· patent location history
2017Patents assigned to CHUNG JI-YOUNG (1)· patent assignee history
2017Based in Namyangju-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 30 | 2005–2020 |
| CHUNG JI YOUNGself | 1 | 2014 |
| CHUNG JI-YOUNGself | 1 | 2017 |
| KIM BONG CHAN | 1 | 2014 |
| KIM DO HYEONG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gyeonggi-do, KR | 13 | 2015–2020 |
| Seongnam-si, KR | 7 | 2016–2020 |
| Kyungki-do, KR | 5 | 2005–2010 |
| Gunpo-si, KR | 4 | 2010–2014 |
| Namyangju-si, KR | 1 | 2017 |