LexDanaLexDanabeta
Inventor

Wolfgang Gmach

Inventor
Emmerting, DE

Overview

2→
Patents
2014–2015
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Dprimary
B23DPlaning33%
B28DWorking stone or stone-like materials33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
PatentTitleYear
9,073,135'Method for slicing wafers from a workpiece'20158,746,227'Method for slicing wafers from a workpiece'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2015Patents assigned to GMACH WOLFGANG (2)· patent assignee history
2014–2015Patents assigned to HUBER ANTON (2)· patent assignee history
2014–2015Patents assigned to KREUZEDER ROBERT (2)· patent assignee history
2014–2015Patents assigned to SILTRONIC AG (2)· patent assignee history
2014–2015Patents assigned to WIESNER PETER (2)· patent assignee history
2014–2015Based in Emmerting, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GMACH WOLFGANGself22014–2015
HUBER ANTON22014–2015
KREUZEDER ROBERT22014–2015
SILTRONIC AG22014–2015
WIESNER PETER22014–2015
Locations
LocationPatentsSpan
Emmerting, DE22014–2015