Inventor
Masaki Haneda
Inventor
Kanagawa, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H01LSemiconductor devices17%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
H10DInorganic electric semiconductor devices10%
A01KAnimal husbandry6%
H04NPictorial communication, e.g. television6%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
PatentTitleYear
11,101,313Solid-state imaging device and electronic apparatus202111,063,020Semiconductor device, manufacturing method for semiconductor device, and electronic device202110,998,369Solid-state imaging device having an electric coupling structure202110,950,637Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment202110,615,210Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment202010,373,934Semiconductor device, manufacturing method for semiconductor device, and electronic device201910,332,927Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment20199,922,961'Semiconductor device, manufacturing method for semiconductor device, and electronic device'20189,559,058'Semiconductor device and method for manufacturing the same'20179,524,925'Method of manufacturing a semiconductor device'20169,343,392'Semiconductor device, manufacturing method for semiconductor device, and electronic device'20168,952,535'Semiconductor transistor device with barrier interconnects'20158,847,282'Semiconductor device and fabrication method'20148,709,896'Semiconductor device and fabrication method'20148,575,012'Semiconductor device production method and semiconductor device'20138,575,704'Semiconductor device and manufacturing method of the semiconductor device'20138,383,484'Semiconductor device production method'20138,168,532'Method of manufacturing a multilayer interconnection structure in a semiconductor device'20128,067,836'Semiconductor device with reduced increase in copper film resistance'20118,003,518'Semiconductor device fabrication method'20117,955,970'Semiconductor device manufacturing method'20117,928,476'Semiconductor device and method of manufacturing the same'20117,803,642'Evaluation method of semiconductor device'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2017Patents assigned to FUJITSU SEMICONDUCTOR LTD (12)· patent assignee history
2010–2017Based in Kawasaki, JP· patent location history
2011–2017Patents assigned to HANEDA MASAKI (7)· patent assignee history
2011–2017Patents assigned to NAKAO YOSHIYUKI (3)· patent assignee history
2011–2017Patents assigned to OHTSUKA NOBUYUKI (3)· patent assignee history
2013–2014Based in Yokohama, JP· patent location history
2016–2021Patents assigned to SONY CORP (8)· patent assignee history
2016–2021Based in Kanagawa, JP· patent location history
2021Based in Yokohama-shi, Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU SEMICONDUCTOR LTD | 12 | 2010–2017 |
| SONY CORP | 8 | 2016–2021 |
| HANEDA MASAKIself | 7 | 2011–2017 |
| NAKAO YOSHIYUKI | 3 | 2011–2017 |
| OHTSUKA NOBUYUKI | 3 | 2011–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 9 | 2016–2021 |
| Kawasaki, JP | 8 | 2010–2017 |
| Yokohama, JP | 5 | 2013–2014 |
| Yokohama-shi, Kanagawa, JP | 1 | 2021 |