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Inventor

Hiroshi Ukeba

Inventor
Futtsu, JP

Overview

2→
Patents
1997–1998
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering40%
Y10TTechnical subjects covered by former us classification40%
C22CAlloys20%
PatentTitleYear
5,759,300'Liquid-phase diffusion bonding alloy foils for joining heat-resistant metals in oxidizing atmospheres'19985,683,822'Liquid-phase diffusion bonding alloy foils for joining heat-resistant metals in oxidizing atmospheres'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–1998Patents assigned to NIPPON STEEL CORP (2)· patent assignee history
1997–1998Based in Futtsu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIPPON STEEL CORP21997–1998
Locations
LocationPatentsSpan
Futtsu, JP21997–1998