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Inventor

Fong Mei Lum

Inventor
MY

Overview

2→
Patents
2023–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
B23KSoldering or unsoldering20%
PatentTitleYear
12,550,751Flip chip bonding for semiconductor packages using metal strip202611,682,644Semiconductor device with a heterogeneous solder joint and method for fabricating the same2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2026Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2023–2026Based in MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG22023–2026
Locations
LocationPatentsSpan
MY22023–2026