Inventor
Hari Prasad Amanapu
Inventor
Guilderland, NY, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H10BElectronic memory devices3%
H10NElectric solid-state devices not otherwise provided for3%
PatentTitleYear
11,127,825Middle-of-line contacts with varying contact area providing reduced contact resistance202111,037,795Planarization of dielectric topography and stopping in dielectric202111,037,875Forming dual metallization interconnect structures in single metallization level202111,031,337Forming dual metallization interconnect structures in single metallization level202111,024,720Non-self aligned contact semiconductor devices202110,978,388Skip via for metal interconnects202110,916,431Robust gate cap for protecting a gate from downstream metallization etch operations202110,832,946Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operations202010,833,173Low-resistance top contact on VTFET202010,833,122Bottom electrode and dielectric structure for MRAM applications202010,818,589Metal interconnect structures with self-forming sidewall barrier layer202010,559,530Forming dual metallization interconnect structures in single metallization level202010,373,867Cobalt contact and interconnect structures201910,204,829Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers201910,177,030Cobalt contact and interconnect structures2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to IBM (15)· patent assignee history
2019–2021Based in Guilderland, NY, US· patent location history
2021Based in Albuquerque, NM, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 15 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Guilderland, New York, US | 14 | 2019–2021 |
| Albuquerque, NM, US | 1 | 2021 |