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Inventor

Zhiwei Jiang

Inventor
Beijing, CN

Overview

2→
Patents
2014–2016
Patent span
Fixed constructions
Primary field (CPC E)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

E04Cprimary
E04CStructural elements33%
H05KPrinted circuits33%
Y02PClimate change mitigation technologies in the production or processing of goods33%
PatentTitleYear
9,410,322'Damping splice sleeve'20168,908,386'Printed circuit board assembly chip package component and soldering component'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to CHEN XIAOCHEN (1)· patent assignee history
2014Patents assigned to GUO ZHIPENG (1)· patent assignee history
2014Patents assigned to HUAWEI DEVICE CO LTD (1)· patent assignee history
2014Patents assigned to JIANG ZHIWEI (1)· patent assignee history
2014Based in Shenzhen, CN· patent location history
2016Patents assigned to UNIV BEIJING TECHNOLOGY (1)· patent assignee history
2016Based in Beijing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHEN XIAOCHEN12014
GUO ZHIPENG12014
HUAWEI DEVICE CO LTD12014
JIANG ZHIWEIself12014
UNIV BEIJING TECHNOLOGY12016
Locations
LocationPatentsSpan
Beijing, CN12016
Shenzhen, CN12014