Inventor
Hong-Ye Shih
Inventor
New Taipei, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices41%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
10,672,737Three-dimensional integrated circuit structure and method of manufacturing the same202010,566,237Profile of through via protrusion in 3DIC interconnect202010,510,641Semiconductor device having backside interconnect structure on through substrate via and method of forming the same201910,163,705Profile of through via protrusion in 3DIC interconnect201810,074,595Self-alignment for redistribution layer20189,786,580'Self-alignment for redistribution layer'20179,449,898'Semiconductor device having backside interconnect structure through substrate via and method of forming the same'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2016Based in Taipei, TW· patent location history
2017–2020Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 6 | 2017–2020 |
| Taipei, TW | 1 | 2016 |