Inventor

Choon Heung Lee

Inventor

Seoul, KR

Overview

2002–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%

H01LSemiconductor devices16%

G06KGraphical data reading11%

H05KPrinted circuits11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

G11CStatic stores2%

H03HImpedance networks, e.g. resonant circuits2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

PatentTitleYear

10,707,181Semiconductor device with redistribution layers formed utilizing dummy substrates2020 10,388,643Semiconductor device using EMC wafer support system and fabricating method thereof2019 10,177,117Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure2019 10,115,705Semiconductor package and manufacturing method thereof2018 9,748,154'Wafer level fan out semiconductor device and manufacturing method thereof'2017 9,627,368'Semiconductor device using EMC wafer support system and fabricating method thereof'2017 9,627,348'Laser assisted bonding for semiconductor die interconnections'2017 9,412,729'Semiconductor package and fabricating method thereof'2016 9,406,639'Semiconductor package and manufacturing method thereof'2016 8,802,494'Method of fabricating a semiconductor device having an interposer'2014 8,183,678'Semiconductor device having an interposer'2012 7,837,120'Modular memory card and method of making same'2010 7,719,845'Chamfered memory card module and method of making same'2010 7,633,763'Double mold memory card and its manufacturing method'2009 7,375,975'Enhanced durability memory card'2008 7,362,038'Surface acoustic wave (SAW) device package and method for packaging a SAW device'2008 7,359,204'Multiple cover memory card'2008 7,220,915'Memory card and its manufacturing method'2007 7,201,327'Memory card and its manufacturing method'2007 7,042,072'Semiconductor package and method of manufacturing the same which reduces warpage'2006 6,995,459'Semiconductor package with increased number of input and output pins'2006 6,995,448'Semiconductor package including passive elements and method of manufacture'2006 6,982,485'Stacking structure for semiconductor chips and a semiconductor package using it'2006 6,936,922'Semiconductor package structure reducing warpage and manufacturing method thereof'2005 6,927,483'Semiconductor package exhibiting efficient lead placement'2005 6,879,034'Semiconductor package including low temperature co-fired ceramic substrate'2005 6,876,068'Semiconductor package with increased number of input and output pins'2005 6,867,071'Leadframe including corner leads and semiconductor package using same'2005 6,750,545'Semiconductor package capable of die stacking'2004 6,469,258'Circuit board for semiconductor package'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2020Patents assigned to AMKOR TECHNOLOGY INC (30)· patent assignee history

2002–2020Based in Seoul, KR· patent location history

2004–2008Based in Kyungki-do, KR· patent location history

2005–2008Based in Gyeonggi-do, KR· patent location history

2007–2008Based in Gwangju, KR· patent location history

2010Based in Yongin-si, KR· patent location history

2012–2017Patents assigned to LEE CHOON HEUNG (3)· patent assignee history

2012–2014Patents assigned to BAE KI CHEOL (2)· patent assignee history

2012–2014Patents assigned to NA DO HYUN (2)· patent assignee history

2017Patents assigned to JUNG BOO YANG (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
AMKOR TECHNOLOGY INC	30	2002–2020
LEE CHOON HEUNGself	3	2012–2017
BAE KI CHEOL	2	2012–2014
NA DO HYUN	2	2012–2014
JUNG BOO YANG	1	2017

Locations

Location	Patents	Span
Seoul, KR	14	2002–2020
Kyungki-do, KR	7	2004–2008
Gwangju, KR	3	2007–2008
Gyeonggi-do, KR	2	2005–2008
Yongin-si, KR	1	2010