Inventor
Steven P. Ostrander
Inventor
Poughkeepsie, NY, US
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices9%
Y10TTechnical subjects covered by former us classification7%
H05KPrinted circuits6%
B82YSpecific uses or applications of nanostructures6%
C01BNon-metallic elements6%
C01GCompounds containing metals not covered by subclasses c01d or c01f6%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds6%
C04BLime, magnesia6%
H10NElectric solid-state devices not otherwise provided for6%
PatentTitleYear
10,777,482Multipart lid for a semiconductor package with multiple components202010,325,830Multipart lid for a semiconductor package with multiple components20199,947,598Determining crackstop strength of integrated circuit assembly at the wafer level20189,601,423'Under die surface mounted electrical elements'20179,543,253'Method for shaping a laminate substrate'20179,366,591'Determining magnitude of compressive loading'20169,272,498'Precast thermal interface adhesive for easy and repeated, separation and remating'20169,219,051'Laminate peripheral clamping to control microelectronic module BSM warpage'20159,059,240'Fixture for shaping a laminate substrate'20159,048,245'Method for shaping a laminate substrate'20158,906,809'Multichip electronic packages and methods of manufacture'20148,900,927'Multichip electronic packages and methods of manufacture'20148,794,079'Determining magnitude of compressive loading'20148,492,199'Reworkable underfills for ceramic MCM C4 protection'20138,363,404'Implementing loading and heat removal for hub module assembly'20138,268,389'Precast thermal interface adhesive for easy and repeated, separation and remating'20128,085,550'Implementing enhanced solder joint robustness for SMT pad structure'20117,816,785'Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package'20107,786,579'Apparatus for crack prevention in integrated circuit packages'20107,462,294'Enhanced thermal conducting formulations'20087,079,393'Fluidic cooling systems and methods for electronic components'20066,908,025'Preparing MCM hat for removal'20056,836,015'Optical assemblies for transmitting and manipulating optical beams'20046,827,505'Optoelectronic package structure and process for planar passive optical and optoelectronic devices'20046,821,026'Redundant configurable VCSEL laser array optical light source'20046,819,813'Optical land grid array interposer'20046,502,999'Opto-electronic transceiver module and hermetically sealed housing therefore'20036,197,222'Lead free conductive composites for electrical interconnections'20015,866,044'Lead free conductive composites for electrical interconnections'19995,813,870'Selectively filled adhesives for semiconductor chip interconnection and encapsulation'19985,716,565'Process for making ultra-fine stabilized zirconia particles'19985,660,774'Process for making a sintered body from ultra-fine superconductive particles'19975,660,773'Process for making ultra-fine yttrium-iron-garnet particles'19975,660,772'Process for making ultra-fine barium hexaferrite particles'19975,545,429'Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess'19965,523,065'Process for making ultra-fine barium titanate particles'19965,468,427'Process for making ultra-fine ceramic particles'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1998Patents assigned to UNIV ALFRED RES (6)· patent assignee history
1995–2001Based in Scotia, NY, US· patent location history
1996–2019Patents assigned to IBM (27)· patent assignee history
2003–2004Based in Wappingers Falls, NY, US· patent location history
2004–2020Based in Poughkeepsie, NY, US· patent location history
2012–2016Patents assigned to OSTRANDER STEVEN P (9)· patent assignee history
2012Based in Yorktown Heights, NY, US· patent location history
2014–2015Patents assigned to ZHENG JIANTAO (3)· patent assignee history
2014Based in Hopewell Junction, NY, US· patent location history
2015–2017Patents assigned to GLOBALFOUNDRIES INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 27 | 1996–2019 |
| OSTRANDER STEVEN Pself | 9 | 2012–2016 |
| UNIV ALFRED RES | 6 | 1995–1998 |
| GLOBALFOUNDRIES INC | 3 | 2015–2017 |
| ZHENG JIANTAO | 3 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 21 | 2004–2020 |
| Scotia, New York, US | 9 | 1995–2001 |
| Wappingers Falls, New York, US | 3 | 2003–2004 |
| Hopewell Junction, New York, US | 2 | 2014 |
| Yorktown Heights, New York, US | 1 | 2012 |