Inventor
Alexander Platz
Inventor
Ebersbach, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
H05KPrinted circuits17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
8,580,672'Methods of forming bump structures that include a protection layer'20138,039,958'Semiconductor device including a reduced stress configuration for metal pillars'20117,829,453'Method for forming solder balls with a stable oxide layer by controlling the reflow ambient'20107,585,759'Technique for efficiently patterning an underbump metallization layer using a dry etch process'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2011Patents assigned to ADVANCED MICRO DEVICES INC (2)· patent assignee history
2009–2010Based in Moritzburg, DE· patent location history
2010–2013Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2011–2013Based in Ebersbach, DE· patent location history
2013Patents assigned to JUNGNICKEL GOTTHARD (1)· patent assignee history
2013Patents assigned to KOSGALWIES SVEN (1)· patent assignee history
2013Patents assigned to KUECHENMEISTER FRANK (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 2 | 2009–2011 |
| GLOBALFOUNDRIES INC | 2 | 2010–2013 |
| JUNGNICKEL GOTTHARD | 1 | 2013 |
| KOSGALWIES SVEN | 1 | 2013 |
| KUECHENMEISTER FRANK | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ebersbach, DE | 2 | 2011–2013 |
| Moritzburg, DE | 2 | 2009–2010 |