Inventor

Tetsuya Ueda

Inventor

Osaka, JP

Overview

1988–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 103 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy7%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution7%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

H01LSemiconductor devices3%

G06KGraphical data reading3%

H01QAntennas, i.e. radio aerials3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

H01PWaveguides2%

PatentTitleYear

11,081,362Method of manufacturing semiconductor device, and recording medium2021 10,879,611Antenna device2020 10,837,011Method and reagent for extracting nucleic acid2020 10,566,016Flexure of hard disk drive2020 10,490,422Manufacturing method for semiconductor device2019 10,407,326Waste liquid treatment device and waste liquid treatment method2019 10,288,606Analysis method and analysis kit for simultaneously detecting or quantitating multiple types of target substances2019 10,194,519Chip mounter, electronic circuit substrate, and power module2019 10,088,419Light measurement apparatus for reaction vessel and light measurement method2018 10,074,598Semiconductor device and manufacturing method thereof2018 10,014,903Non-reciprocal transmission apparatus with different backward and forward propagation constants, provided for circularly polarized wave antenna apparatus2018 9,899,871'Islanded operating system'2018 9,808,806'System and method for automated nucleic acid amplification'2017 9,556,477'Light measurement apparatus for reaction vessel and light measurement method'2017 9,490,511'Nonreciprocal transmission line apparatus whose propagation constants in forward and backward directions are different from each other'2016 9,300,891'Solid-state imaging device and method of manufacturing the same'2016 9,293,390'Heat radiation structure for semiconductor device'2016 9,184,316'Solid-state imaging apparatus and method for manufacturing same'2015 9,115,418'Method of recovering platinum group elements'2015 9,054,406'Nonreciprocal transmission line apparatus having asymmetric structure of transmission line'2015 9,029,994'Semiconductor device'2015 8,947,317'Microwave resonator configured by composite right/left-handed meta-material and antenna apparatus provided with the microwave resonator'2015 8,695,231'Method for controlling drying of clothes and dryer for clothes'2014 8,669,833'Three-dimensional metamaterial having function of allowing and inhibiting propagation of electromagnetic waves'2014 8,502,385'Power semiconductor device'2013 8,294,538'Transmission line microwave apparatus including at least one non-reciprocal transmission line part between two parts'2012 8,129,062'Fuel cell system operation method'2012 8,034,707'Method for fabricating semiconductor device and semiconductor device'2011 7,830,014'Method for fabricating semiconductor device and semiconductor device'2010 7,811,712'Fuel cell system and operation method thereof'2010 7,772,709'Resin sealed semiconductor device and manufacturing method therefor'2010 7,749,891'Method and fabricating semiconductor device and semiconductor device'2010 7,740,987'Fuel cell cogeneration system, method of operating'2010 7,736,815'Method of operating a fuel cell system by detecting leakage of a combustible gas'2010 7,718,290'Cogeneration system'2010 7,622,807'Semiconductor device with a low dielectric constant film between lower interconnections'2009 7,504,168'Systems for controlling operation of a fuel cell electricity generating system responsive to detection of abnormalities'2009 7,473,632'Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap'2009 7,432,004'Fuel cell electric power generating system and method of stopping fuel cell electric power generation'2008 7,265,450'Semiconductor device and method for fabricating the same'2007 7,144,761'Semiconductor device and method for fabricating the same'2006 7,052,790'Fuel cell system and operation method having a condensed water tank open to atmosphere'2006 7,033,687'Fuel cell power generation system and method of controlling fuel cell power generation'2006 7,011,901'Fuel cell generation system and method'2006 6,972,119'Apparatus for forming hydrogen'2005 6,919,267'Method for forming wiring structure'2005 6,904,337'Power generation control system, power generation control method, program, and medium'2005 6,881,660'Method for forming wiring structure'2005 6,858,549'Method for forming wiring structure'2005 6,852,302'Carbon monoxide removing apparatus and process for operating the same'2005 6,800,963'Power controller, power generation system, and control method of power controller'2004 6,780,779'Method of fabricating semiconductor device'2004 6,759,322'Method for forming wiring structure'2004 6,727,011'Fuel cell system and method of operating fuel cell system'2004 6,545,361'Semiconductor device having multilevel interconnection structure and method for fabricating the same'2003 6,495,451'Method of forming interconnect'2002 6,455,436'Method of fabricating semiconductor device'2002 6,300,242'Semiconductor device and method of fabricating the same'2001 6,252,427'CMOS inverter and standard cell using the same'2001 6,242,336'Semiconductor device having multilevel interconnection structure and method for fabricating the same'2001 6,232,237'Method for fabricating semiconductor device'2001 6,071,755'Method of manufacturing semiconductor device'2000 5,986,313'Semiconductor device comprising MISFETS and method of manufacturing the same'1999 5,969,426'Substrateless resin encapsulated semiconductor device'1999 5,962,920'Semiconductor device and a manufacturing method thereof'1999 5,760,429'Multi-layer wiring structure having varying-sized cutouts'1998 5,733,812'Semiconductor device with a field-effect transistor having a lower resistance impurity diffusion layer, and method of manufacturing the same'1998 5,701,033'Semiconductor device'1997 5,603,742'Dust removing apparatus'1997 5,592,019'Semiconductor device and module'1997 5,576,247'Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture'1996 5,545,919'Semiconductor device and method of fabricating the same'1996 5,518,513'Dust removing apparatus'1996 5,508,232'Method of manufacturing a semiconductor device'1996 5,385,867'Method for forming a multi-layer metallic wiring structure'1995 5,334,872'Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad'1994 5,327,012'Semiconductor device having a double-layer interconnection structure'1994 5,309,021'Semiconductor device having particular power distribution interconnection arrangement'1994 5,295,752'Printer using double sheets of pressure sensitive paper'1994 5,198,884'Semiconductor devices having a double-layer interconnection structure'1993 5,196,917'Carrier tape'1993 5,180,436'Microwave plasma film deposition system'1993 5,166,099'Manufacturing method for semiconductor device'1992 5,157,478'Tape automated bonding packaged semiconductor device incorporating a heat sink'1992 5,134,093'Method of fabricating a semiconductor device including a protective layer'1992 5,126,824'Carrier tape and method of manufacturing semiconductor device employing the same'1992 5,125,358'Microwave plasma film deposition system'1992 5,105,261'Semiconductor device package having particular lead structure for mounting multiple circuit boards'1992 5,083,191'Semiconductor device'1992 5,076,877'Apparatus for dry etching'1991 5,073,817'Resin encapsulated semiconductor device with heat radiator'1991 5,064,706'Carrier tape including molten resin flow path element for resin packaged semiconductor devices'1991 5,031,026'Thin semiconductor card'1991 5,025,307'Modular semiconductor device'1991 5,004,899'Semiconductor card which can be folded'1991 4,949,158'Semiconductor device'1990 4,926,034'Connector in external device for connection to IC card'1990 4,865,193'Tape carrier for tape automated bonding process and a method of producing the same'1989 4,864,116'Mechanism for connecting an IC card to an external device'1989 4,849,617'Semiconductor card which can be folded'1989 4,838,804'Mechanism for connecting IC card and external device'1989 4,839,713'Package structure for semiconductor device'1989 4,764,803'Thin semiconductor card'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–2019Patents assigned to MITSUBISHI ELECTRIC CORP (33)· patent assignee history

1988–1994Based in Itami, JP· patent location history

1991–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (33)· patent assignee history

1992–2018Based in Osaka, JP· patent location history

1997–2019Based in Tokyo, JP· patent location history

2004–2012Based in Kasugai, JP· patent location history

2009–2016Patents assigned to PANASONIC CORP (14)· patent assignee history

2012–2015Patents assigned to UEDA TETSUYA (9)· patent assignee history

2012–2020Based in Kyoto, JP· patent location history

2017–2020Patents assigned to UNIVERSAL BIO RESEARCH CO LTD (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	33	1991–2008
MITSUBISHI ELECTRIC CORP	33	1988–2019
PANASONIC CORP	14	2009–2016
UEDA TETSUYAself	9	2012–2015
UNIVERSAL BIO RESEARCH CO LTD	4	2017–2020

Locations

Location	Patents	Span
Osaka, JP	31	1992–2018
Itami, JP	21	1988–1994
Kasugai, JP	12	2004–2012
Tokyo, JP	9	1997–2019
Kyoto, JP	5	2012–2020