Inventor
JUN IZUOKA
Inventor
JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H01LSemiconductor devices29%
B23KSoldering or unsoldering14%
H05KPrinted circuits14%
PatentTitleYear
12,581,964Lead frame, semiconductor device, and lead frame manufacturing method202611,837,530Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame202311,647,584Circuit board, and electronic device2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to SHINKO ELECTRIC IND CO (3)· patent assignee history
2023–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 3 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 3 | 2023–2026 |