Inventor
Sudeep Mandal
Inventor
Bangalore, IN
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
C23CCoating metallic material5%
H01CResistors5%
H10DInorganic electric semiconductor devices5%
G01VGeophysics4%
G21KHandling of particles or ionising radiation not otherwise provided for4%
H10NElectric solid-state devices not otherwise provided for4%
PatentTitleYear
11,073,633NMR ASIC202110,634,890Miniaturized microscope for phase contrast and multicolor fluorescence imaging202010,400,574Apparatus and method for inspecting integrity of a multi-barrier wellbore201910,393,532Emergency responsive navigation201910,304,763Producing wafer level packaging using leadframe strip and related device201910,249,590Stacked dies using one or more interposers201910,208,587System and method for monitoring integrity of a wellbore201910,170,224Low temperature fabrication of lateral thin film varistor201910,120,102Fluid sensor cable assembly, system, and method201810,049,570Controlling right-of-way for priority vehicles201810,043,962Thermoelectric cooling using through-silicon vias201810,013,519Performance matching in three-dimensional (3D) integrated circuit (IC) using back-bias compensation20189,952,500Adjusting of patterns in design layout for optical proximity correction20189,941,458Integrated circuit cooling using embedded peltier micro-vias in substrate20189,913,405'Glass interposer with embedded thermoelectric devices'20189,892,999'Producing wafer level packaging using leadframe strip and related device'20189,869,607'Systems and methods for distributed measurement'20189,870,851'Low temperature fabrication of lateral thin film varistor'20189,871,020'Through silicon via sharing in a 3D integrated circuit'20189,865,674'Low temperature fabrication of lateral thin film varistor'20189,585,257'Method of forming a glass interposer with thermal vias'20179,569,571'Method and system for timing violations in a circuit'20179,559,283'Integrated circuit cooling using embedded peltier micro-vias in substrate'20179,536,732'Low temperature fabrication of lateral thin film varistor'20179,496,234'Wafer-level chip-scale package structure utilizing conductive polymer'20169,472,483'Integrated circuit cooling apparatus'20169,410,892'Nanoscale optofluidic devices for molecular detection'20169,356,089'Low temperature fabrication of lateral thin film varistor'20169,184,112'Cooling apparatus for an integrated circuit'20159,068,927'Laboratory diffraction-based phase contrast imaging technique'20159,008,278'Multilayer X-ray source target with high thermal conductivity'20158,552,363'System and method for optically driven separations using fluid filled core optical fibers'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2016Patents assigned to ERICKSON DAVID (2)· patent assignee history
2013–2016Patents assigned to MANDAL SUDEEP (2)· patent assignee history
2015–2019Patents assigned to IBM (12)· patent assignee history
2015–2020Patents assigned to GEN ELECTRIC (7)· patent assignee history
2015–2019Based in Bangalore, IN· patent location history
2015–2018Based in Niskayuna, NY, US· patent location history
2016–2019Patents assigned to GLOBALFOUNDRIES INC (11)· patent assignee history
2019Based in Durham, NC, US· patent location history
2020Based in Morrisville, NC, US· patent location history
2021Based in Cambridge, MA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 12 | 2015–2019 |
| GLOBALFOUNDRIES INC | 11 | 2016–2019 |
| GEN ELECTRIC | 7 | 2015–2020 |
| ERICKSON DAVID | 2 | 2013–2016 |
| MANDAL SUDEEPself | 2 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Bangalore, IN | 22 | 2015–2019 |
| Niskayuna, New York, US | 4 | 2015–2018 |
| Durham, NC, US | 2 | 2019 |
| Cambridge, Massachusetts, US | 1 | 2021 |
| Morrisville, NC, US | 1 | 2020 |