Inventor
TECK SIM LEE
Inventor
MY
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices47%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H05KPrinted circuits6%
PatentTitleYear
12,094,793Package with electrically insulated carrier and at least one step on encapsulant202411,942,383Linear spacer for spacing a carrier of a package202411,876,028Package with electrically insulated carrier and at least one step on encapsulant202411,804,424Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip202311,676,881Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package202311,600,547Semiconductor package with expanded heat spreader202311,355,424Multi-chip package202211,348,866Package and lead frame design for enhanced creepage and clearance2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INFINEON TECHNOLOGIES AG (5)· patent assignee history
2022–2023Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (3)· patent assignee history
2022–2024Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 5 | 2022–2024 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 3 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 8 | 2022–2024 |