Inventor
Somilkumar J. RATHI
Inventor
US
Overview
Patents· 52 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices17%
H10DInorganic electric semiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H01LSemiconductor devices12%
G11CStatic stores11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H10NElectric solid-state devices not otherwise provided for6%
C23CCoating metallic material4%
A01NPreservation of bodies of humans or animals or plants or parts thereof1%
A01PBiocidal, pest repellant, pest attractant or plant growth regulatory activity of chemical compounds or preparations1%
PatentTitleYear
12,593,456Method of fabricating transistors and stacked non-planar capacitors for memory and logic applications202612,563,737Memory device fabrication through wafer bonding202612,464,730Method of forming capacitors through wafer bonding202512,446,231Method of integrating a capacitor including a non-linear polar material with a transistor through wafer bonding202512,444,603Smooth titanium nitride layers and methods of forming the same202512,439,606Gate coupled non-linear polar material based capacitors for memory and logic202512,408,569Titanium silicon nitride barrier layer202512,385,133Field-deployable antimicrobial surface products for gas/air and liquid/water purification and methods of fabrication of the same202512,376,312Methods of fabricating planar capacitors on a shared plate electrode202512,369,326Capacitor devices with shared electrode and methods of fabrication202512,349,365Drain coupled non-linear polar material based capacitors for memory and logic202512,336,184Methods of fabricating trench capacitors on a shared plate electrode202512,328,878Integration of 2T-202512,324,162Stacked capacitors with shared electrodes and methods of fabrication202512,324,163Planar capacitors with shared electrode and methods of fabrication202512,302,905Field-deployable antimicrobial product assemblies for air and water purification and methods of fabrication of the same202512,308,226Conformal and smooth titanium nitride layers and methods of forming the same202512,289,894Method of fabricating transistors and stacked planar capacitors for memory and logic applications202512,274,071Capacitor integrated with a transistor for logic and memory applications202512,262,541Trench capacitors with shared electrode202512,165,918Conformal titanium nitride-based thin films and methods of forming same202412,147,941Iterative monetization of precursor in process development of non-linear polar material and devices202412,094,923Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based memory devices202412,062,584Iterative method of multilayer stack development for device applications202412,034,086Trench capacitors with continuous dielectric layer and methods of fabrication202412,029,043Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications and methods of fabrication202412,022,662Planar and trench capacitors for logic and memory applications and methods of fabrication202412,016,185Planar and trench capacitors for logic and memory applications202412,010,854Multi-level hydrogen barrier layers for memory applications and methods of fabrication202411,996,438Pocket flow for trench capacitors integrated with planar capacitors on a same substrate and method of fabrication202411,985,832Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications202411,961,877Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures202411,955,512Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures and methods of fabrication202411,942,365Multi-region diffusion barrier containing titanium, silicon and nitrogen202411,908,704Method of fabricating a perovskite-material based planar capacitor using rapid thermal annealing (RTA) methodologies202411,894,417Method of fabricating a perovskite-material based trench capacitor using rapid thermal annealing (RTA) methodologies202411,871,584Multi-level hydrogen barrier layers for memory applications202411,869,928Dual hydrogen barrier layer for memory devices202411,869,843Integrated trench and via electrode for memory device applications and methods of fabrication202411,862,517Integrated trench and via electrode for memory device applications202411,844,203Conductive and insulative hydrogen barrier layer for memory devices202311,844,225Dual hydrogen barrier layer for memory devices integrated with low density film for logic structures and methods of fabrication202311,839,088Integrated via and bridge electrodes for memory array applications and methods of fabrication202311,839,070High density dual encapsulation materials for capacitors and methods of fabrication202311,832,537Titanium silicon nitride barrier layer202311,769,790Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based trench capacitors202311,765,908Memory device fabrication through wafer bonding202311,741,428Iterative monetization of process development of non-linear polar material and devices202311,587,784Smooth titanium nitride layers and methods of forming the same202311,482,413Conformal and smooth titanium nitride layers and methods of forming the same202211,361,992Conformal titanium nitride-based thin films and methods of forming same202211,328,944Systems and methods of placing substrates in semiconductor manufacturing equipment2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to EUGENUS INC (10)· patent assignee history
2022–2026Based in US· patent location history
2023–2026Patents assigned to KEPLER COMPUTING INC (40)· patent assignee history
2025Patents assigned to KAVACH NANOTECHNOLOGIES INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KEPLER COMPUTING INC | 40 | 2023–2026 |
| EUGENUS INC | 10 | 2022–2025 |
| KAVACH NANOTECHNOLOGIES INC | 2 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 52 | 2022–2026 |