Inventor

Chien-Hua Chen

Inventor

Corvallis, OR, US

Overview

1995–2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 240 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary

B41JTypewriters24%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%

H01LSemiconductor devices5%

Y10TTechnical subjects covered by former us classification5%

B81BMicrostructural devices or systems, e.g. micromechanical devices4%

H10DInorganic electric semiconductor devices4%

H05KPrinted circuits3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

G02BOptical elements, systems or apparatus2%

PatentTitleYear

10,871,449SERS sensor apparatus with passivation film2020 10,864,719Fluid ejection device including integrated circuit2020 10,861,840Integrated passive component and method for manufacturing the same2020 10,850,446Three-dimensional (3D) printing with epoxy mold compound2020 10,836,169Molded printhead2020 10,836,178Printing fluid cartridge with electrodes and method to the level of fluid in a printing fluid cartridge2020 10,836,162Print head interposers2020 10,833,144Semiconductor device packages including an inductor and a capacitor2020 10,830,704Frame layer receiving a substrate supported SEL stage2020 10,821,729Transfer molded fluid flow structure2020 10,815,121Composite wafers2020 10,780,696Printbars and methods of forming printbars2020 10,780,697Fluid ejection dies2020 10,780,698Inverted TIJ2020 10,753,815Relative pressure sensor2020 10,751,997Flexible carrier for fluid flow structure2020 10,723,128Fluid ejection device including fluid output channel2020 10,702,103Flip-top washing device for vegetables and fruits2020 10,685,898Circuit package2020 10,661,567Printheads and methods of fabricating a printhead2020 10,647,128Fluid level sensor2020 10,640,369Microelectromechanical system (MEMS) devices2020 10,632,752Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure2020 10,603,916Method of making a fluid structure having compression molded fluid channel2020 10,603,911Printhead2020 10,605,541Heat pipe--thermal storage medium based cool storage system2020 10,576,748Fluid reservoir with fluid property and level detection2020 10,557,391Incineration system and process2020 10,557,798Substrate supported SEL stage and housing2020 10,559,512Circuit package2020 10,500,859Molded die slivers with exposed front and back surfaces2019 10,493,766Fluid level sensing with protective member2019 10,495,388Thermal energy storage system with tunable phase change composition2019 10,490,341Electrical device2019 10,479,085Printhead electrical interconnects2019 10,479,086Process for making a molded device assembly and printhead assembly2019 10,471,714Printhead2019 10,475,718Semiconductor device package comprising a dielectric layer with built-in inductor2019 10,475,734Semiconductor device package2019 10,472,228MEMS device package and method for manufacturing the same2019 10,464,324Molded fluid flow structure2019 10,438,864Circuit packages comprising epoxy mold compounds and methods of compression molding2019 10,434,774Fluid ejection die and glass-based support substrate2019 10,427,407Printer circuit board fluid ejection apparatus2019 10,421,279Molded printhead2019 10,421,278Fluid ejection die and plastic-based substrate2019 10,421,274Printbars and methods of forming printbars2019 10,384,450Inkjet printhead2019 10,377,142Overmolded ink delivery device2019 10,369,793Service structures in print heads2019 10,342,140Printed circuit board to molded compound interface2019 10,328,694Printed circuit board with recessed pocket for fluid droplet ejection die2019 10,319,657Circuit package having a plurality of epoxy mold compounds with different compositions2019 10,304,765Semiconductor device package2019 10,300,701Printed circuit board fluid ejection apparatus2019 10,272,680Fluid ejection device2019 10,276,468Circuit package2019 10,232,619Printhead with bond pad surrounded by dam2019 10,232,621Process for making a molded device assembly and printhead assembly2019 10,232,618Fluid flow structure2019 10,232,620Printhead with s-shaped die2019 10,226,926Printbars and methods of forming printbars2019 10,220,620Molded printhead structure2019 10,211,137Semiconductor device package2019 10,207,508Printhead cartridge molded with nozzle health sensor2019 10,207,500Print head interposers2019 10,195,851Printhead die2019 10,189,265Printing fluid cartridge2019 10,166,776Molded fluid flow structure2019 10,160,213Molded fluid flow structure2018 10,160,209Flexible carrier for fluid flow structure2018 10,112,408Fluid ejection device with fluid feed holes2018 10,081,188Molded fluid flow structure with saw cut channel2018 10,081,186Molded die slivers with exposed front and back surfaces2018 10,076,914Fluid ejection device with fluid feed holes2018 10,058,119Fruit and vegetable washer2018 10,029,467Molded printhead2018 10,016,983Overmolded ink delivery device2018 9,997,447Semiconductor devices2018 9,944,080Molded fluid flow structure2018 9,929,132'Semiconductor device and process of making the same'2018 9,919,524'Printhead with bond pad surrounded by dam'2018 9,919,525'Printed circuit board fluid ejection apparatus'2018 9,902,162'Molded print bar'2018 9,895,888'Fluid flow structure'2018 9,895,889'Printhead assembly'2018 9,889,664'Molded printhead structure'2018 9,892,982'Method for controlling exhaust flow in wafer processing module'2018 9,881,917'Semiconductor device and method of manufacturing the same'2018 9,844,946Molded printhead2017 9,837,352Semiconductor device and method for manufacturing the same2017 9,788,277'Power saving mechanism for in-pocket detection'2017 9,770,909'Printhead dies molded with nozzle health sensor'2017 9,751,319'Printing fluid cartridge'2017 9,731,509'Fluid structure with compression molded fluid channel'2017 9,724,920'Molded die slivers with exposed front and back surfaces'2017 9,707,753'Printhead die'2017 9,707,766'Fluid directing assembly'2017 9,676,192'Printbar and method of forming same'2017 9,656,469'Molded fluid flow structure with saw cut channel'2017 9,636,633'Method for making a porous silica aerogel composite membrane'2017 9,617,174'Hydrophobic porous silica aerogel composite membrane and vacuum membrane distillation method'2017 9,595,726'Fuel reforming system and process'2017 9,577,027'Semiconductor device and process of making the same'2017 9,561,463'Porous silica aerogel composite membrane and method for making the same and carbon dioxide sorption device'2017 9,539,814'Molded printhead'2017 9,517,626'Printed circuit board fluid ejection apparatus'2016 9,489,844'Apparatus for locating a vehicle and methods utilizing the same'2016 9,446,590'Diagonal openings in photodefinable glass'2016 9,446,587'Molded printhead'2016 9,355,834'Adhesive transfer'2016 9,329,425'Transparent display apparatus'2016 9,287,126'Multi-wafer pair anodic bonding apparatus and method'2016 9,266,326'Piezoelectric actuator and method of making a piezoelectric actuator'2016 9,129,758'Rocker switch device'2015 8,963,671'Semiconductor transformer device and method for manufacturing the same'2015 8,958,819'Femto-assisted location estimation in macro-femto heterogeneous networks'2015 8,896,591'Pixel circuit'2014 8,864,289'Drop detection'2014 8,853,819'Semiconductor structure with passive element network and manufacturing method thereof'2014 8,778,769'Semiconductor package having passive device and method for making the same'2014 8,766,970'Pixel circuit, display panel, and driving method thereof'2014 8,721,157'Backlight module structure preventing light leakage from protrusion in optical sheets'2014 8,690,295'Fluid nozzle array'2014 8,502,589'Signal swing trimming apparatus and method thereof'2013 8,497,577'Micro electrical mechanical system'2013 8,477,255'Liquid crystal display device'2013 8,415,790'Semiconductor package having passive device and method for making the same'2013 8,375,200'Embedded device and file change notification method of the embedded device'2013 8,368,173'Semiconductor package and method for making the same'2013 8,354,977'Driving method for solving problem of cross talk effect of display panel'2013 8,336,981'Determining a healthy fluid ejection nozzle'2012 8,314,697'Electric system and alarm device thereof'2012 8,276,838'General winding and feeding apparatus'2012 8,274,133'Semiconductor package and method for making the same'2012 8,263,493'Silicon chip having through via and method for making the same'2012 8,217,473'Micro electro-mechanical system packaging and interconnect'2012 8,197,030'Fluid ejector structure'2012 8,174,094'Bonded structures formed by plasma enhanced bonding'2012 8,109,607'Fluid ejector structure and fabrication method'2012 8,039,205'Fluidic MEMS device'2011 8,027,130'Fan system and power reverse protection apparatus thereof'2011 8,007,078'Microfluidic device and a fluid ejection device incorporating the same'2011 7,988,264'Method for forming a fluid ejection device'2011 7,991,988'Communication device and firmware update method thereof'2011 7,928,680'Fan system and starting method thereof'2011 7,919,943'Fan system and starting method thereof'2011 7,916,108'Liquid crystal display panel with color washout improvement and applications of same'2011 7,874,654'Fluid manifold for fluid ejection device'2011 7,866,364'Fabrication tool for bonding'2011 7,833,830'3D interconnect with protruding contacts'2010 7,828,417'Microfluidic device and a fluid ejection device incorporating the same'2010 7,766,462'Method for forming a fluid ejection device'2010 7,741,157'System and method for direct bonding of substrates'2010 7,732,902'Semiconductor package with getter formed over an irregular structure'2010 7,723,811'Packaged MEMS device assembly'2010 7,692,403'Power control apparatus'2010 7,682,934'Wafer packaging and singulation method'2010 7,633,570'Liquid crystal display with uniform feed-through voltage'2009 7,619,535'Power monitoring apparatus of fan'2009 7,611,919'Bonding interface for micro-device packaging'2009 7,609,067'Electronic portion of an ion gauge with ion collectors bowed out of plane to form a three dimensional arrangement'2009 7,596,095'Network device test system and method for testing network device'2009 7,576,439'Electrically connecting substrate with electrical device'2009 7,563,691'Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding'2009 7,549,225'Method of forming a printhead'2009 7,541,209'Method of forming a device package having edge interconnect pad'2009 7,534,662'Methods for hermetic sealing of post media-filled MEMS package'2009 7,508,132'Device having a getter structure and a photomask'2009 7,494,593'Method for forming a cantilever and tip'2009 7,482,682'Micro-device packaging'2009 7,476,608'Electrically connecting substrate with electrical device'2009 7,470,557'Self-aligned coating on released MEMS'2008 7,442,576'Placement of absorbing material in a semiconductor device'2008 7,443,001'Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering'2008 7,436,571'Micro-displays'2008 7,422,962'Method of singulating electronic devices'2008 7,417,307'System and method for direct-bonding of substrates'2008 7,382,512'Resistivity phase change material'2008 7,378,785'Polarizing photonic band gap system with reflector'2008 7,376,303'Optical coupling assembly'2008 7,332,411'Systems and methods for wafer bonding by localized induction heating'2008 7,320,899'Micro-displays and their manufacture'2008 7,309,467'Fluidic MEMS device'2007 7,307,773'Micro-optoelectromechanical system packages for a light modulator and methods of making the same'2007 7,300,812'Micro electrical mechanical system'2007 7,288,425'Hybrid cantilever and tip'2007 7,282,448'Substrate and method of forming substrate for fluid ejection device'2007 7,271,561'Fan module and control device thereof'2007 7,262,495'3D interconnect with protruding contacts'2007 7,261,793'System and method for low temperature plasma-enhanced bonding'2007 7,262,498'Assembly with a ring and bonding pads formed of a same material on a substrate'2007 7,211,881'Structure for containing desiccant'2007 7,212,699'Fabricating a photonic die'2007 7,205,675'Micro-fabricated device with thermoelectric device and method of making'2007 7,196,410'Wafer packaging and singulation method'2007 7,187,124'Transparent electron source emitter device and method'2007 D0537795'Quad push button switch'2007 7,151,883'Photonic crystal device and methods'2006 7,147,908'Semiconductor package with getter formed over an irregular structure'2006 7,103,972'Method of fabricating a fluid ejection device'2006 7,098,978'Wide-viewing angle liquid crystal display'2006 7,087,134'System and method for direct-bonding of substrates'2006 D0526282'Push-button for switch'2006 D0524256'Push-button for switch'2006 D0522346'Switch stand'2006 D0521360'Switch stand'2006 7,045,885'Placement of absorbing material in a semiconductor device'2006 7,026,189'Wafer packaging and singulation method'2006 7,019,886'Light modulator'2006 D0518001'Push-button for switch'2006 7,018,044'Display system incorporating spectral separation and homogenization'2006 7,004,034'Pressure sensor and method of making the same having membranes forming a capacitor'2006 6,981,759'Substrate and method forming substrate for fluid ejection device'2006 6,979,585'Micro-electromechanical system'2005 6,969,667'Electrical device and method of making'2005 6,946,728'System and methods for hermetic sealing of post media-filled MEMS package'2005 6,933,237'Substrate etch method and device'2005 6,917,099'Die carrier with fluid chamber'2005 6,902,259'Direct imaging polymer fluid jet orifice'2005 6,893,577'Method of forming substrate for fluid ejection device'2005 6,852,633'Method for operating chemical mechanical polishing (â€œCMPâ€) tool for the manufacture of semiconductor devices'2005 6,718,632'Method of making a fluid-jet ejection device'2004 6,679,587'Fluid ejection device with a composite substrate'2004 6,662,663'Pressure sensor with two membranes forming a capacitor'2003 6,583,382'Apparatus for creating re-entrant nozzles'2003 6,554,403'Substrate for fluid ejection device'2003 6,534,247'Method of fabricating micromachined ink feed channels for an inkjet printhead'2003 6,488,366'Fluid ejecting device with anchor grooves'2002 6,481,832'Fluid-jet ejection device'2002 6,454,393'Chamber and orifice shape variations in an orifice plate'2002 6,387,575'Redirecting optical mask for creating re-entrant nozzles'2002 6,364,466'Particle tolerant ink-feed channel structure for fully integrated inkjet printhead'2002 6,303,274'Ink chamber and orifice shape variations in an ink-jet orifice plate'2001 6,273,557'Micromachined ink feed channels for an inkjet printhead'2001 6,261,742'Method for manufacturing a printhead with re-entrant nozzles'2001 6,066,291'Nickel aluminide intermetallic alloys for tooling applications'2000 6,033,498'Thermal processing of nickel aluminide alloys to improve mechanical properties'2000 5,417,897'Method for forming tapered inkjet nozzles'1995 5,378,137'Mask design for forming tapered inkjet nozzles'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2003Patents assigned to HEWLETT PACKARD CO (11)· patent assignee history

1995–2020Based in Corvallis, OR, US· patent location history

2003–2020Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (147)· patent assignee history

2006–2017Based in Taipei, TW· patent location history

2007–2017Based in Taoyuan County, TW· patent location history

2008–2016Patents assigned to CHEN CHIEN-HUA (27)· patent assignee history

2009–2017Based in Hsinchu, TW· patent location history

2012–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (19)· patent assignee history

2012–2020Based in Kaohsiung, TW· patent location history

2016–2020Patents assigned to HEWLETT PACKARD DEVELOPMENT CO LP (15)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	147	2003–2020
CHEN CHIEN-HUAself	27	2008–2016
ADVANCED SEMICONDUCTOR ENG	19	2012–2020
HEWLETT PACKARD DEVELOPMENT CO LP	15	2016–2020
HEWLETT PACKARD CO	11	1995–2003

Locations

Location	Patents	Span
Corvallis, OR, US	173	1995–2020
Kaohsiung, TW	18	2012–2020
Taipei, TW	12	2006–2017
Hsinchu, TW	8	2009–2017
Taoyuan County, TW	7	2007–2017