Inventor
Harold D. Meyer
Inventor
South Windsor, CT, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Lprimary
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices9%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers9%
H10BElectronic memory devices9%
H10DInorganic electric semiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
10,930,753Trench isolation for advanced integrated circuit structure fabrication20215,448,444'Capacitive pressure sensor having a reduced area dielectric spacer'19955,381,299'Capacitive pressure sensor having a substrate with a curved mesa'19954,954,925'Capacitive sensor with minimized dielectric drift'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1995Patents assigned to UNITED TECHNOLOGIES CORP (3)· patent assignee history
1990–1995Based in South Windsor, CT, US· patent location history
2021Patents assigned to INTEL CORP (1)· patent assignee history
2021Based in Hillsboro, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED TECHNOLOGIES CORP | 3 | 1990–1995 |
| INTEL CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| South Windsor, CT, US | 3 | 1990–1995 |
| Hillsboro, OR, US | 1 | 2021 |