Inventor
Sung-Feng Yeh
Inventor
Taipei, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
G02BOptical elements, systems or apparatus6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
11,114,413Stacking structure, package structure and method of fabricating the same202111,069,608Semiconductor structure and manufacturing method thereof202111,069,658System on integrated chips and methods of forming same202111,063,022Package and manufacturing method of reconstructed wafer202111,063,019Package structure, chip structure and method of fabricating the same202111,056,438Semiconductor packages and method of forming the same20217,154,601'Testing method for a polarizing plate'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006Patents assigned to OPTIMAX TECH CORP (1)· patent assignee history
2006Based in Taoyuan, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021 |
| OPTIMAX TECH CORP | 1 | 2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 6 | 2021 |
| Taoyuan, TW | 1 | 2006 |