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Inventor

Hiroyuki Kitabayashi

Inventor
Itami, JP

Overview

29→
Patents
1992–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H03Hprimary
H03HImpedance networks, e.g. resonant circuits17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H10DInorganic electric semiconductor devices13%
H01LSemiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H10HInorganic light-emitting semiconductor devices having potential barriers8%
Y10TTechnical subjects covered by former us classification8%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material3%
B24DTools for grinding, buffing or sharpening3%
G01BMeasuring length, thickness or similar linear dimensions3%
PatentTitleYear
10,056,247Method of manufacturing silicon carbide semiconductor device20189,646,834'Method for manufacturing semiconductor device'20179,543,154'Method for manufacturing semiconductor device'20179,449,823'Method for manufacturing silicon carbide semiconductor device'20169,384,981'Method of manufacturing silicon carbide semiconductor device'20169,331,164'Silicon carbide semiconductor device'20169,330,916'Method of manufacturing silicon carbide semiconductor device'20168,916,462'Method for manufacturing semiconductor device'20148,227,279'Manufacturing method of a semiconductor element'20127,560,740'Light-emitting device'20097,547,910'Semiconductor light-emitting device and method of manufacturing semiconductor light-emitting device'20097,491,974'Light-emitting device'20097,476,909'Light emitting device'20097,423,284'Light emitting device, method for making the same, and nitride semiconductor substrate'20086,356,006'Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device'20026,320,296'Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device'20016,210,780'Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device'20016,025,636'Surface acoustic wave device incorporating single crystal LiNbO.sub.3'20005,959,389'Diamond-ZnO surface acoustic wave device'19995,888,646'Surface acoustic wave device'19995,838,090'Surface acoustic wave device'19985,814,918'Diamond-ZnO surface acoustic wave device'19985,783,896'Diamond-Zn0 surface acoustic wave device'19985,777,422'Diamond-ZnO surface acoustic wave device having relatively thinner ZnO piezoelectric layer'19985,531,087'Metal sheet bending machine'19965,367,902'Metal sheet bending machine'19945,243,811'Grinder and method of manufacturing the same'19935,178,497'Electrodeposited reamer tool'19935,151,109'Grinder and method of manufacturing the same'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–1996Patents assigned to KOMATSU MFG CO LTD (5)· patent assignee history
1992–1993Based in Neyagawa, JP· patent location history
1993–2018Based in Osaka, JP· patent location history
1994–1996Based in Hirakata, JP· patent location history
1998–2018Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (23)· patent assignee history
1998–2009Based in Itami, JP· patent location history
1999Based in Hyogo, JP· patent location history
2012–2014Patents assigned to KITABAYASHI HIROYUKI (2)· patent assignee history
2012Patents assigned to ARAKAWA SATOSHI (1)· patent assignee history
2014Patents assigned to HORII TAKU (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SUMITOMO ELECTRIC INDUSTRIES231998–2018
KOMATSU MFG CO LTD51992–1996
KITABAYASHI HIROYUKIself22012–2014
ARAKAWA SATOSHI12012
HORII TAKU12014
Locations
LocationPatentsSpan
Itami, JP131998–2009
Osaka, JP111993–2018
Hirakata, JP21994–1996
Neyagawa, JP21992–1993
Hyogo, JP11999