Inventor
Mark M. Konarski
Inventor
Old Saybrook, CT, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%
C09JAdhesives11%
Y10TTechnical subjects covered by former us classification10%
C08LCompositions of macromolecular compounds9%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
H05KPrinted circuits3%
B23KSoldering or unsoldering2%
PatentTitleYear
10,995,210Curable compositions202110,815,388Primer compositions for injection molding202010,141,532Curable encapsulants and use thereof20189,676,928'Curable encapsulants and use thereof'20179,080,084'Photolytically induced redox curable compositions'20157,915,319'Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions'20117,547,735'UV curable compositions'20097,193,016'Epoxy-extended polyacrylate toughening agent'20077,108,920'Reworkable compositions incorporating episulfide resins'20067,109,061'Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith'20067,087,304'Polysulfide-based toughening agents, compositions containing same and methods for the use thereof'20067,009,009'Fluxing underfill compositions'20066,951,907'Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex'20056,893,736'Thermosetting resin compositions useful as underfill sealants'20056,818,318'Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex'20046,706,417'Fluxing underfill compositions'20046,670,430'Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes'20036,667,194'Method of bonding die chip with underfill fluxing composition'20036,632,893'Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners'20036,617,399'Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners'20036,519,968'Shipping container for exothermic material'20036,458,472'Fluxing underfill compositions'20026,391,993'High temperature, controlled strength anaerobic compositions curable under ambient environmental conditions'20026,342,577'Thermosetting resin compositions useful as underfill sealants'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2004Patents assigned to HENKEL LOCTITE CORP (6)· patent assignee history
2002–2003Patents assigned to LOCTITE CORP (3)· patent assignee history
2002–2021Based in Old Saybrook, CT, US· patent location history
2004–2011Patents assigned to HENKEL CORP (9)· patent assignee history
2015–2021Patents assigned to Henkel IP & Holding GmbH (5)· patent assignee history
2017–2018Patents assigned to HENKEL AG & CO KGAA (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HENKEL CORP | 9 | 2004–2011 |
| HENKEL LOCTITE CORP | 6 | 2002–2004 |
| Henkel IP & Holding GmbH | 5 | 2015–2021 |
| LOCTITE CORP | 3 | 2002–2003 |
| HENKEL AG & CO KGAA | 2 | 2017–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Old Saybrook, CT, US | 24 | 2002–2021 |