Inventor
Seok Ling Lim
Inventor
Kulim, MY
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices45%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H01PWaveguides9%
PatentTitleYear
10,504,854Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same201910,396,047Semiconductor package with package components disposed on a package substrate within a footprint of a die201910,163,777Interconnects for semiconductor packages20189,972,589Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer20189,159,714'Package on wide I/O silicon'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2019Patents assigned to INTEL CORP (5)· patent assignee history
2015–2019Based in Kulim, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2015–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kulim, MY | 5 | 2015–2019 |