Inventor
Tatsuo Kawata
Inventor
Shimodate, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds21%
C08LCompositions of macromolecular compounds21%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
6,774,501'Resin-sealed semiconductor device, and die bonding material and sealing material for use therein'20046,284,818'Encapsulant composition and electronic device'20016,211,277'Encapsulating material and LOC structure semiconductor device using the same'20015,567,990'Resin-encapsulated semiconductor device'19964,965,657'Resin encapsulated semiconductor device'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2004Patents assigned to HITACHI CHEMICAL CO LTD (5)· patent assignee history
1990Patents assigned to HITACHI LTD (1)· patent assignee history
1990–2001Based in Shimodate, JP· patent location history
2001Based in Ibaraki, JP· patent location history
2004Based in Yuki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 5 | 1990–2004 |
| HITACHI LTD | 1 | 1990 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shimodate, JP | 3 | 1990–2001 |
| Yuki, JP | 1 | 2004 |
| Ibaraki, JP | 1 | 2001 |