Inventor
Jianghua Wei
Inventor
Raleigh, NC, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics17%
H05BElectric heating17%
H05KPrinted circuits9%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts6%
C09JAdhesives6%
Y10TTechnical subjects covered by former us classification6%
B05DProcesses for applying fluent materials to surfaces, in general4%
B24BMachines, devices, or processes for grinding or polishing4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,857,389Proton therapy system based on compact superconducting cyclotron20206,497,786'Methods and apparatus for bonding deformable materials having low deformation temperatures'20026,312,548'Conductive insert for bonding components with microwave energy'20016,103,812'Microwave curable adhesive'20005,879,756'Curing polymer layers on semiconductor substrates using variable frequency microwave energy'19995,844,216'System and apparatus for reducing arcing and localized heating during microwave processing'19985,844,217'Appratus for liquid thermosetting resin molding using radiofrequency wave heating'19985,804,801'Adhesive bonding using variable frequency microwave energy'19985,798,395'Adhesive bonding using variable frequency microwave energy'19985,770,143'Method for liquid thermosetting resin molding using radiofrequency wave heating'19985,750,968'System and apparatus for reducing arcing and localized heating during microwave processing'19985,738,915'Curing polymer layers on semiconductor substrates using variable frequency microwave energy'19985,648,038'Systems and methods for monitoring material properties using microwave energy'19975,644,837'Process for assembling electronics using microwave irradiation'19975,470,423'Microwave pultrusion apparatus and method of use'19955,406,056'Electromagnetic curing apparatus and method of use'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1998Patents assigned to UNIV MICHIGAN STATE (4)· patent assignee history
1995Based in East Lansing, MI, US· patent location history
1997–2000Patents assigned to LAMBDA TECHNOLOGIES INC (8)· patent assignee history
1997–2001Patents assigned to LAMBDA TECHNOLOGIES (2)· patent assignee history
1997–2002Based in Raleigh, NC, US· patent location history
1998Patents assigned to LOCKHEED MARTIN ENERGY RES COR (2)· patent assignee history
2020Patents assigned to HEFEI CAS ION MEDICAL & TECHNICAL DEVICES CO LTD (1)· patent assignee history
2020Based in Anhui, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAMBDA TECHNOLOGIES INC | 8 | 1997–2000 |
| UNIV MICHIGAN STATE | 4 | 1995–1998 |
| LAMBDA TECHNOLOGIES | 2 | 1997–2001 |
| LOCKHEED MARTIN ENERGY RES COR | 2 | 1998 |
| HEFEI CAS ION MEDICAL & TECHNICAL DEVICES CO LTD | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Raleigh, NC, US | 13 | 1997–2002 |
| East Lansing, MI, US | 2 | 1995 |
| Anhui, CN | 1 | 2020 |