Inventor
NOBUYUKI TAKADA
Inventor
JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing41%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1041%
H01LSemiconductor devices18%
PatentTitleYear
12,569,957Substrate processing apparatus and substrate processing method202612,318,881Substrate polishing apparatus and substrate polishing method202512,211,733Substrate processing apparatus and substrate processing method202512,017,323Polishing head system and polishing apparatus202411,911,872Substrate processing apparatus and substrate processing method202411,735,457Substrate processing apparatus and substrate processing method202311,633,828Substrate polishing system, substrate polishing method and substrate polishing apparatus2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to EBARA CORP (7)· patent assignee history
2023–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 7 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 7 | 2023–2026 |