Inventor

CHIN-SZU LEE

Inventor
TW

Overview

28→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H10BElectronic memory devices10%
C23CCoating metallic material9%
H10NElectric solid-state devices not otherwise provided for9%
H01JElectric discharge tubes or discharge lamps7%
G11CStatic stores4%
H10DInorganic electric semiconductor devices4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
PatentTitleYear
12,581,863MRAM fabrication and device202612,500,106Semiconductor processing tool and methods of operation202512,394,611Semiconductor tool for copper deposition202512,364,165Methods to improve magnetic tunnel junction memory cells by treating native oxide202512,327,715Semiconductor tool for copper deposition202512,315,720Method for improving surface of semiconductor device202512,310,248Diffusion barrier layer on interconnection vias for magnetic tunnel junctions202512,300,540Conductive feature of semiconductor device and method of forming same202512,274,176Method of manufacturing MRAM device with enhanced etch control202512,227,839Sealing article comprising metal coating, method of making and method of using the same202512,215,414Shutter disc for a semiconductor processing tool202512,112,930Method for improving deposition process202412,035,538Method of forming memory device with physical vapor deposition system202411,985,904Method of manufacturing MRAM device with enhanced etch control202411,939,664System and method for performing semiconductor processes with coated bell jar202411,920,238Sealing article comprising metal coating, method of making and method of using the same202411,901,295Dielectric film for semiconductor fabrication202411,864,467MRAM fabrication and device202411,851,754Sealing article comprising metal coating, method of making and method of using the same202311,844,283Method to improve magnetic tunnel junction memory cells by treating native oxide202311,827,970Shutter disc for a semiconductor processing tool202311,749,524Method for improving surface of semiconductor device202311,728,170Contact structure202311,696,510Diffusion layer for magnetic tunnel junctions202311,658,032Semiconductor epitaxy bordering isolation structure202311,296,027Dielectric film for semiconductor fabrication202211,189,654Manufacturing methods of semiconductor image sensor devices202111,152,306Dielectric film for semiconductor fabrication2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (28)· patent assignee history
2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD282021–2026
Locations
LocationPatentsSpan
TW282021–2026