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Inventor

ATSUKO UEDA

Inventor
JP

Overview

3→
Patents
2024–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Gprimary
C09GPolishing compositions15%
C09KMaterials for miscellaneous applications, not provided for elsewhere15%
H01LSemiconductor devices15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
B24BMachines, devices, or processes for grinding or polishing8%
G05BControl or regulating systems in general8%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes8%
G16CComputational chemistry8%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
12,565,599Slurry, polishing method, and method for manufacturing semiconductor component202612,522,748Slurry, polishing method, and method for producing semiconductor component202611,994,839Optimization system of manufacturing process and method thereof2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to HITACHI LTD (1)· patent assignee history
2024–2026Based in JP· patent location history
2026Patents assigned to RESONAC CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RESONAC CORP22026
HITACHI LTD12024
Locations
LocationPatentsSpan
JP32024–2026