Inventor
Gonzalo Amador
Inventor
Dallas, TX, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H01JElectric discharge tubes or discharge lamps15%
G01NInvestigating or analysing materials by determining their chemical or physical properties13%
H05KPrinted circuits6%
B23KSoldering or unsoldering5%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
B25JManipulators2%
B29CShaping or joining of plastics2%
B82YSpecific uses or applications of nanostructures2%
PatentTitleYear
RE046350'Method for stem sample inspection in a charged particle beam instrument'20179,349,573'Total release method for sample extraction in an energetic-beam instrument'20168,288,740'Method for preparing specimens for atom probe analysis and specimen assemblies made thereby'20128,247,768'Method for stem sample inspection in a charged particle beam instrument'20128,227,781'Variable-tilt specimen holder and method and for monitoring milling in a charged-particle instrument'20128,168,949'Method for stem sample inspection in a charged particle beam instrument'20128,054,558'Multiple magnification optical system with single objective lens'20117,935,937'Method of forming TEM sample holder'20117,834,315'Method for STEM sample inspection in a charged particle beam instrument'20107,644,637'Method and apparatus for transfer of samples in a controlled environment'20107,138,726'Protective interleaf for stacked wafer shipping'20067,071,013'Fixture and method for uniform electroless metal deposition on integrated circuit bond pads'20066,940,167'Variable cross-section plated mushroom with stud for bumping'20056,926,150'Protective interleaf for stacked wafer shipping'20056,800,555'Wire bonding process for copper-metallized integrated circuits'20046,750,134'Variable cross-section plated mushroom with stud for bumping'20046,432,744'Wafer-scale assembly of chip-size packages'20026,303,407'Method for the transfer of flux coated particles to a substrate'20016,245,583'Low stress method and apparatus of underfilling flip-chip electronic devices'20016,234,296'System for positioning a carrier relative to a travel path'20016,234,374'Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source'20016,227,353'System for applying a rotary force to strips of varying widths'20016,226,452'Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging'20016,069,342'Automated multiple lead frame strip radiant die attach material curing apparatus'20006,041,994'Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source'20005,993,591'Coring of leadframes in carriers via radiant heat source'19995,783,025'Optical diebonding for semiconductor devices'19985,201,453'Linear, direct-drive microelectronic bonding apparatus and method'19935,114,066'Voice coil programmable wire tensioner'19924,978,050'Damped optics tube assembly'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2006Patents assigned to TEXAS INSTRUMENTS INC (20)· patent assignee history
1990–2017Based in Dallas, TX, US· patent location history
2010–2017Patents assigned to OMNIPROBE INC (8)· patent assignee history
2012Patents assigned to AMADOR GONZALO (4)· patent assignee history
2012Patents assigned to MOORE THOMAS M (3)· patent assignee history
2012Patents assigned to ZAYKOVA-FELDMAN LYUDMILA (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 20 | 1990–2006 |
| OMNIPROBE INC | 8 | 2010–2017 |
| AMADOR GONZALOself | 4 | 2012 |
| MOORE THOMAS M | 3 | 2012 |
| ZAYKOVA-FELDMAN LYUDMILA | 3 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dallas, Texas, US | 30 | 1990–2017 |