Inventor
Lei Bai
Inventor
Shenzhen, CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
F04DNon-positive-displacement pumps9%
G06FElectric digital data processing9%
G09FDisplaying9%
H01LSemiconductor devices9%
H01RElectrically-conductive connections9%
H10KOrganic electric solid-state devices9%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution9%
Y02PClimate change mitigation technologies in the production or processing of goods9%
PatentTitleYear
10,797,253Fabrication method and fabrication assembly for flexible display substrate202010,161,420Fan20189,370,118'PCB plug mechanism, finished board, and subrack'20169,215,831'Heat dissipation system'20158,842,441'Electronic device, electronic system, and circuit board interconnection architecture of the same'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2018Patents assigned to HUAWEI TECH CO LTD (4)· patent assignee history
2014–2018Based in Shenzhen, CN· patent location history
2020Patents assigned to BEIJING BOE DISPLAY TECH CO (1)· patent assignee history
2020Patents assigned to BOE TECHNOLOGY GROUP CO LTD (1)· patent assignee history
2020Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HUAWEI TECH CO LTD | 4 | 2014–2018 |
| BEIJING BOE DISPLAY TECH CO | 1 | 2020 |
| BOE TECHNOLOGY GROUP CO LTD | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenzhen, CN | 4 | 2014–2018 |
| Beijing, CN | 1 | 2020 |