Inventor
Christopher A. Bode
Inventor
Austin, TX, US
Overview
Patents· 65 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
G05BControl or regulating systems in general26%
Y02PClimate change mitigation technologies in the production or processing of goods19%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
H01JElectric discharge tubes or discharge lamps3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
B24BMachines, devices, or processes for grinding or polishing1%
G01DMeasuring not specially adapted for a specific variable1%
G01RMeasuring electric variables1%
PatentTitleYear
11,036,416Deduplicated storage with multiple storage domains20218,615,314'Process control using analysis of an upstream process'20138,321,048'Associating data with workpieces and correlating the data with yield data'20128,185,230'Method and apparatus for predicting device electrical parameters during fabrication'20127,797,073'Controlling processing of semiconductor wafers based upon end of line parameters'20107,558,687'Method and apparatus for dynamic adjustment of a sensor sampling rate'20097,519,447'Method and apparatus for integrating multiple sample plans'20097,502,702'Method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities'20097,445,945'Method and apparatus for dynamic adjustment of a sampling plan based on wafer electrical test data'20087,424,392'Applying a self-adaptive filter to a drifting process'20087,299,154'Method and apparatus for fast disturbance detection and classification'20077,200,459'Method for determining optimal photolithography overlay targets based on process performance and yield in microelectronic fabrication'20077,120,514'Method and apparatus for performing field-to-field compensation'20067,103,439'Method and apparatus for initializing tool controllers based on tool event data'20067,069,103'Controlling cumulative wafer effects'20067,020,535'Method and apparatus for providing excitation for a process controller'20066,978,189'Matching data related to multiple metrology tools'20056,970,757'Method and apparatus for updating control state variables of a process control model based on rework data'20056,957,120'Multi-level process data representation'20056,947,803'Dispatch and/or disposition of material based upon an expected parameter result'20056,937,914'Method and apparatus for controlling process target values based on manufacturing metrics'20056,912,436'Prioritizing an application of correction in a multi-input control system'20056,901,340'Method and apparatus for distinguishing between sources of process variation'20056,897,075'Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information'20056,871,114'Updating process controller based upon fault detection analysis'20056,823,231'Tuning of a process control based upon layer dependencies'20046,821,792'Method and apparatus for determining a sampling plan based on process and equipment state information'20046,815,232'Method and apparatus for overlay control using multiple targets'20046,810,296'Correlating an inline parameter to a device operation parameter'20046,808,946'Method of using critical dimension measurements to control stepper process parameters'20046,801,817'Method and apparatus for integrating multiple process controllers'20046,790,570'Method of using scatterometry measurements to control stepper process parameters'20046,788,988'Method and apparatus using integrated metrology data for pre-process and post-process control'20046,785,586'Method and apparatus for adaptively scheduling tool maintenance'20046,778,873'Identifying a cause of a fault based on a process controller output'20046,756,243'Method and apparatus for cascade control using integrated metrology'20046,751,518'Dynamic process state adjustment of a processing tool to reduce non-uniformity'20046,746,308'Dynamic lot allocation based upon wafer state characteristics, and system for accomplishing same'20046,745,086'Method and apparatus for determining control actions incorporating defectivity effects'20046,741,903'Method for relating photolithography overlay target damage and chemical mechanical planarization (CMP) fault detection to CMP tool indentification'20046,737,208'Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information'20046,732,007'Method and apparatus for implementing dynamic qualification recipes'20046,708,075'Method and apparatus for utilizing integrated metrology data as feed-forward data'20046,699,727'Method for prioritizing production lots based on grade estimates and output requirements'20046,698,009'Method and apparatus for modeling of batch dynamics based upon integrated metrology'20046,687,561'Method and apparatus for determining a sampling plan based on defectivity'20046,675,058'Method and apparatus for controlling the flow of wafers through a process flow'20046,664,013'Methods of characterizing device performance based upon the duration of an endpointed photoresist develop process, and system for accomplishing same'20036,665,623'Method and apparatus for optimizing downstream uniformity'20036,650,955'Method and apparatus for determining a sampling plan based on process and equipment fingerprinting'20036,622,061'Method and apparatus for run-to-run controlling of overlay registration'20036,615,098'Method and apparatus for controlling a tool using a baseline control script'20036,610,550'Method and apparatus for correlating error model with defect data'20036,607,926'Method and apparatus for performing run-to-run control in a batch manufacturing environment'20036,605,479'Method of using damaged areas of a wafer for process qualifications and experiments, and system for accomplishing same'20036,589,875'Method of selectively processing wafer edge regions to increase wafer uniformity, and system for accomplishing same'20036,577,914'Method and apparatus for dynamic model building based on machine disturbances for run-to-run control of semiconductor devices'20036,576,385'Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thickness'20036,569,692'Automated method of controlling photoresist develop time to control critical dimensions, and system for accomplishing same'20036,535,774'Incorporation of critical dimension measurements as disturbances to lithography overlay run to run controller'20036,528,331'Method for identifying and controlling impact of ambient conditions on photolithography processes'20036,410,351'Method and apparatus for modeling thickness profiles and controlling subsequent etch process'20026,405,096'Method and apparatus for run-to-run controlling of overlay registration'20026,368,883'Method for identifying and controlling impact of ambient conditions on photolithography processes'20026,248,602'Method and apparatus for automated rework within run-to-run control semiconductor manufacturing'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001Patents assigned to AMD INC (1)· patent assignee history
2001–2013Based in Austin, TX, US· patent location history
2002–2013Patents assigned to ADVANCED MICRO DEVICES INC (61)· patent assignee history
2004Patents assigned to ADAVANCED MICRO DEVICES INC (1)· patent assignee history
2012–2013Patents assigned to BODE CHRISTOPHER A (3)· patent assignee history
2012Patents assigned to COSS JR ELFIDO (1)· patent assignee history
2021Based in Cary, NC, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 61 | 2002–2013 |
| BODE CHRISTOPHER Aself | 3 | 2012–2013 |
| ADAVANCED MICRO DEVICES INC | 1 | 2004 |
| AMD INC | 1 | 2001 |
| COSS JR ELFIDO | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Austin, Texas, US | 64 | 2001–2013 |
| Cary, NC, US | 1 | 2021 |