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Inventor

Pei-Hwa Tsao

Inventor
Taichung, TW

Overview

2→
Patents
2002–2006
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,154,185'Encapsulation method for SBGA'20066,372,619'Method for fabricating wafer level chip scale package with discrete package encapsulation'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2006Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2002–2006Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG22002–2006
Locations
LocationPatentsSpan
Taichung, TW22002–2006