Inventor
Jin-Wook Jeong
Inventor
Kyunggi province, KR
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
B41JTypewriters12%
H05KPrinted circuits12%
H10KOrganic electric solid-state devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G01RMeasuring electric variables5%
B29CShaping or joining of plastics2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
G01BMeasuring length, thickness or similar linear dimensions2%
PatentTitleYear
11,037,496Method of driving a display panel for an organic light-emitting display device202110,679,930Metal core solder ball interconnector fan-out wafer level package202010,021,790Module with internal wire fence shielding20189,842,888'Organic light emitting display device and method of manufacturing the same'20179,693,445'Printed circuit board with thermal via'20179,559,080'Integrated circuit device packages and methods for manufacturing integrated circuit device packages'20179,379,360'Organic light emitting display apparatus including lower and upper auxiliary electrodes'20169,192,048'Bonding pad for printed circuit board and semiconductor chip package using same'20159,151,795'Apparatus for inspecting passive component having signal transmission line'20159,151,778'Semiconductor device test socket'20159,072,168'Electromagnetic interference blocking device and circuit assembly including the same'20159,062,968'PCB loading apparatus for measuring thickness of printed circuit board stack'20159,048,454'Organic light emitting display apparatus and method of manufacturing the same'20158,434,845'Image forming apparatus and ink jetting method thereof'20138,410,597'Three dimensional semiconductor device'20137,936,365'Printing method and apparatus using shuttle thermal print head'20117,708,379'Method and apparatus for driving printer head and image formation'20107,407,249'Array type inkjet printer with multi-pass structure and method of compensating an irregular nozzle defect thereof'20087,367,641'Method of driving a print head and image forming device employing the method'20087,306,971'Semiconductor chip packaging method with individually placed film adhesive pieces'20077,238,258'System for peeling semiconductor chips from tape'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2013Patents assigned to SAMSUNG ELECTRONICS CO LTD (5)· patent assignee history
2008–2013Based in Yongin-si, KR· patent location history
2013–2020Patents assigned to HANA MICRON INC (3)· patent assignee history
2013–2017Patents assigned to JEONG JIN-WOOK (2)· patent assignee history
2013–2021Based in Asan-si, KR· patent location history
2015–2018Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (7)· patent assignee history
2015–2021Patents assigned to SAMSUNG DISPLAY CO LTD (4)· patent assignee history
2015–2018Based in Kyunggi province, KR· patent location history
2015–2016Based in Yongin, KR· patent location history
2020Based in Chungcheongnam-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECHNOLOGIES GENERAL IP | 7 | 2015–2018 |
| SAMSUNG ELECTRONICS CO LTD | 5 | 2008–2013 |
| SAMSUNG DISPLAY CO LTD | 4 | 2015–2021 |
| HANA MICRON INC | 3 | 2013–2020 |
| JEONG JIN-WOOKself | 2 | 2013–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyunggi province, KR | 6 | 2015–2018 |
| Yongin-si, KR | 5 | 2008–2013 |
| Asan-si, KR | 4 | 2013–2021 |
| Yongin, KR | 2 | 2015–2016 |
| Chungcheongnam-do, KR | 1 | 2020 |