Inventor

CHIA-HSIANG CHANG

Inventor

Overview

3→

Patents

2022–2023

Patent span

Electricity

Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary

B22FWorking metallic powder10%

B29CShaping or joining of plastics10%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering10%

G06FElectric digital data processing10%

H01LSemiconductor devices10%

H03KPulse technique10%

H03MCoding10%

H04LTransmission of digital information, e.g. telegraphic communication10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

Y02PClimate change mitigation technologies in the production or processing of goods10%

PatentTitleYear

11,850,799Powdered surface monitoring system of additive manufacturing2023 11,742,295Interface of integrated circuit die and method for arranging interface thereof2023 11,336,427Circuit of communication interface between two dies and method to manage communication interface2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to GLOBAL UNICHIP CORP (2)· patent assignee history

2022–2023Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history

2022–2023Based in TW· patent location history

2023Patents assigned to NAT CHUNG SHAN INST SCIENCE & TECH (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GLOBAL UNICHIP CORP	2	2022–2023
TAIWAN SEMICONDUCTOR MFG CO LTD	2	2022–2023
NAT CHUNG SHAN INST SCIENCE & TECH	1	2023

Locations

Location	Patents	Span
TW	3	2022–2023