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Inventor

Masayuki Morishima

Inventor
Yokohama, JP

Overview

3→
Patents
2001–2005
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
H05KPrinted circuits25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
6,869,008'Method of forming bumps'20056,402,014'Method of forming bumps'20026,213,386'Method of forming bumps'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2005Patents assigned to HITACHI LTD (3)· patent assignee history
2001–2005Based in Yokohama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD32001–2005
Locations
LocationPatentsSpan
Yokohama, JP32001–2005