Inventor
Hiroshi Akamatsu
Inventor
Boise, ID, US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G11Cprimary
G11CStatic stores64%
H03KPulse technique7%
G05FSystems for regulating electric or magnetic variables4%
G21FProtection against x-radiation, gamma radiation, corpuscular radiation or particle bombardment4%
H05KPrinted circuits4%
A01MCatching, trapping or scaring of animals2%
B23KSoldering or unsoldering2%
H01FMagnets2%
H10DInorganic electric semiconductor devices2%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
PatentTitleYear
11,087,835Memory device latch circuitry202111,011,212Delay calibration oscillators for a memory device202110,998,893Semiconductor device, delay circuit, and related method202110,978,130Temperature-based access timing for a memory device202110,937,515Fuse latch circuits and related apparatuses, systems, and methods202110,867,660Apparatus and methods for controlling refresh operations202010,848,153Leakage current reduction in electronic devices202010,734,067Memory device latch circuitry202010,607,686Apparatuses and methods for controlling refresh operations202010,186,363Magnetic component unit201910,153,031Apparatuses and methods for controlling refresh operations201810,074,443Semiconductor device including fuse circuit20189,922,694'Apparatuses and methods for controlling refresh operations'20189,865,359'Semiconductor device including fuse circuit'20189,741,447'Semiconductor device including fuse circuit'20178,737,158'Semiconductor device and method of controlling the same'20148,730,742'Device'20147,973,298'Transport/storage cask for radioactive material'20117,791,402'Electric fuse determination circuit and determination method'20107,293,692'Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method'20076,728,149'Semiconductor memory device'20046,483,761'Semiconductor memory device'20026,304,503'Semiconductor memory device'20016,222,781'Semiconductor integrated circuit device capable of externally applying power supply potential to internal circuit while restricting noise'20016,163,177'Semiconductor integrated circuit device having output buffer'20006,134,681'Semiconductor memory device with spare memory cell'20005,887,042'Cask for a radioactive material and radiation shield'19995,815,032'Semiconductor device capable of preventing fluctuations of substrate potential'19985,777,933'Semiconductor memory device capable of reading/writing data from/into arbitrary memory cell in an input/output compression test mode'19985,768,290'Semiconductor integrated circuit device incorporating fuse-programmable pass/fail identification circuit and pass/fail determination method thereof'19985,659,260'Sense amplifier having a circuit for compensating for potential voltage drops caused by parasitic interconnections'19975,631,867'Semiconductor storage device requiring short time for program voltage to rise'19975,539,353'Circuit for compensating for potential voltage drops caused by parasitic interconnection resistance'19964,044,495'Device for capturing cockroaches'1977Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1977Patents assigned to EARTH CHEMICAL CO (1)· patent assignee history
1996–2002Patents assigned to MITSUBISHI ELECTRIC CORP (11)· patent assignee history
1996–2004Based in Hyogo, JP· patent location history
1999–2011Patents assigned to KOBE STEEL LTD (2)· patent assignee history
1999–2011Based in Takasago, JP· patent location history
2010–2014Based in Tokyo, JP· patent location history
2014Patents assigned to AKAMATSU HIROSHI (2)· patent assignee history
2017–2021Patents assigned to MICRON TECHNOLOGY INC (14)· patent assignee history
2017–2021Based in Boise, ID, US· patent location history
2019Based in Fukushima, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 14 | 2017–2021 |
| MITSUBISHI ELECTRIC CORP | 11 | 1996–2002 |
| AKAMATSU HIROSHIself | 2 | 2014 |
| KOBE STEEL LTD | 2 | 1999–2011 |
| EARTH CHEMICAL CO | 1 | 1977 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 14 | 2017–2021 |
| Hyogo, JP | 12 | 1996–2004 |
| Tokyo, JP | 3 | 2010–2014 |
| Takasago, JP | 2 | 1999–2011 |
| Fukushima, JP | 1 | 2019 |