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Inventor

XINCHUN LU

Inventor
CN

Overview

2→
Patents
2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing40%
G01BMeasuring length, thickness or similar linear dimensions20%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,151,335Monitoring method for chemical mechanical polishing and chemical mechanical polishing device202412,109,664Method for determining thickness of metal film of wafer, polishing device, and medium2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to HWATSING BEIJING TECH CO LTD (1)· patent assignee history
2024Patents assigned to HWATSING TECH CO LTD (1)· patent assignee history
2024Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HWATSING BEIJING TECH CO LTD12024
HWATSING TECH CO LTD12024
Locations
LocationPatentsSpan
CN22024