Inventor
Lakshmanan Karuppiah
Inventor
San Jose, CA, US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
B08BCleaning in general6%
B24DTools for grinding, buffing or sharpening6%
G01BMeasuring length, thickness or similar linear dimensions5%
H01LSemiconductor devices5%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool4%
G05BControl or regulating systems in general4%
A46BBrushes3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
9,862,070'Systems and methods for substrate polishing end point detection using improved friction measurement'20189,711,381'Methods and apparatus for post-chemical mechanical planarization substrate cleaning'20179,646,859'Disk-brush cleaner module with fluid jet'20179,472,475'Feedback control using detection of clearance and adjustment for uniform topography'20169,431,267'Semiconductor device processing tools and methods for patterning substrates'20169,073,169'Feedback control of polishing using optical detection of clearance'20159,061,394'Systems and methods for substrate polishing end point detection using improved friction measurement'20158,874,250'Spectrographic monitoring of a substrate during processing using index values'20148,813,293'Apparatus and methods for brush and pad conditioning'20148,628,376'In-line wafer thickness sensing'20148,586,481'Chemical planarization of copper wafer polishing'20138,554,351'Spectrographic monitoring of a substrate during processing using index values'20138,458,843'Apparatus and methods for brush and pad conditioning'20138,337,278'Wafer edge characterization by successive radius measurements'20128,260,446'Spectrographic monitoring of a substrate during processing using index values'20128,250,695'Roller assembly for a brush cleaning device in a cleaning module'20128,210,900'Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery'20128,211,325'Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications'20128,172,643'Polishing system having a track'20128,014,004'Determining physical property of substrate'20117,952,708'High throughput measurement system'20117,914,363'Smart conditioner rinse station'20117,840,375'Methods and apparatus for generating a library of spectra'20107,774,086'Substrate thickness measuring during polishing'20107,746,485'Determining physical property of substrate'20107,657,342'Substrate thickness measuring during polishing'20107,611,400'Smart conditioner rinse station'20097,520,968'Conductive pad design modification for better wafer-pad contact'20097,504,018'Electrochemical method for Ecmp polishing pad conditioning'20097,444,198'Determining physical property of substrate'20087,422,982'Method and apparatus for electroprocessing a substrate with edge profile control'20087,409,260'Substrate thickness measuring during polishing'20087,344,432'Conductive pad with ion exchange membrane for electrochemical mechanical polishing'20087,210,981'Smart conditioner rinse station'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2018Patents assigned to APPLIED MATERIALS INC (33)· patent assignee history
2007–2018Based in San Jose, CA, US· patent location history
2012–2018Patents assigned to KARUPPIAH LAKSHMANAN (15)· patent assignee history
2012–2015Patents assigned to SWEDEK BOGUSLAW A (5)· patent assignee history
2012–2015Patents assigned to TU WEN-CHIANG (3)· patent assignee history
2013–2017Patents assigned to KO SEN-HOU (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 33 | 2007–2018 |
| KARUPPIAH LAKSHMANANself | 15 | 2012–2018 |
| SWEDEK BOGUSLAW A | 5 | 2012–2015 |
| KO SEN-HOU | 3 | 2013–2017 |
| TU WEN-CHIANG | 3 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 34 | 2007–2018 |