Inventor
CHING-NEN PENG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables38%
H01LSemiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H01QAntennas, i.e. radio aerials8%
G01BMeasuring length, thickness or similar linear dimensions4%
G06FElectric digital data processing4%
H02HEmergency protective circuit arrangements4%
H02JElectric power networks4%
H05FStatic electricity4%
H05KPrinted circuits4%
PatentTitleYear
11,852,672Test circuit and method202311,726,112Electromagnetic shielding during wafer stage testing202311,579,190Testing holders for chip unit and die package202311,467,203Test circuit and method202211,387,683Composite integrated circuits and methods for wireless interactions therewith202211,340,291Testing holders for chip unit and die package202211,249,112Devices for high-density probing techniques and method of implementing the same202211,231,453Alignment testing for tiered semiconductor structure202211,229,109Three dimensional integrated circuit electrostatic discharge protection and prevention test interface2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2023Based in TW· patent location history
2023Patents assigned to TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2023 |
| TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2023 |