Inventor
Anna M. Prakash
Inventor
Chandler, AZ, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B23KSoldering or unsoldering5%
H05KPrinted circuits5%
B03CMagnetic or electrostatic separation of solid materials from solid materials or fluids2%
B25HWorkshop equipment, e.g. for marking-out work2%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
PatentTitleYear
10,615,128Systems and methods for electromagnetic interference shielding202010,315,200Apparatus and system for storing and transporting magnetic devices201910,168,357Coated probe tips for plunger pins of an integrated circuit package test system201910,049,971Package structure to enhance yield of TMI interconnections20189,991,211Semiconductor package having an EMI shielding layer20189,953,929Systems and methods for electromagnetic interference shielding20189,704,811'Perforated conductive material for EMI shielding of semiconductor device and components'20179,685,413'Semiconductor package having an EMI shielding layer'20179,631,065'Methods of forming wafer level underfill materials and structures formed thereby'20179,613,933'Package structure to enhance yield of TMI interconnections'20178,183,697'Apparatus and methods of forming an interconnect between a workpiece and substrate'20127,843,075'Apparatus and methods of forming an interconnect between a workpiece and substrate'20107,776,657'Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same'20107,651,020'Amphiphilic block copolymers for improved flux application'20107,332,807'Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same'20086,717,561'Driving a liquid crystal display'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Based in Mesa, AZ, US· patent location history
2008–2020Patents assigned to INTEL CORP (15)· patent assignee history
2008–2020Based in Chandler, AZ, US· patent location history
2012–2017Patents assigned to PRAKASH ANNA M (2)· patent assignee history
2012Patents assigned to ASHTON II TOMMY (1)· patent assignee history
2017Patents assigned to ARAVAMUDHAN SRINIVASA R (1)· patent assignee history
2017Patents assigned to DANI ASHAY A (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 15 | 2008–2020 |
| PRAKASH ANNA Mself | 2 | 2012–2017 |
| ARAVAMUDHAN SRINIVASA R | 1 | 2017 |
| ASHTON II TOMMY | 1 | 2012 |
| DANI ASHAY A | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 15 | 2008–2020 |
| Mesa, AZ, US | 1 | 2004 |