Inventor
Amruthavalli ALUR
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H01FMagnets11%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
12,476,174Ultra-thin, hyper-density semiconductor packages202512,406,914Ultra-thin, hyper-density semiconductor packages202512,336,196Magnetic core inductors on package substrates202511,676,950Via-in-via structure for high density package integrated inductor202311,508,636Multi-layer solution based deposition of dielectrics for advanced substrate architectures202211,430,724Ultra-thin, hyper-density semiconductor packages2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (6)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2025 |