Inventor

Makoto Imanishi

Inventor

Neyagawa, JP

Overview

22→

Patents

1997–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%

Y10TTechnical subjects covered by former us classification18%

H05KPrinted circuits8%

B23KSoldering or unsoldering4%

H02KDynamo-electric machines2%

H02PControl or regulation of electric motors, electric generators or dynamo-electric converters2%

H10DInorganic electric semiconductor devices2%

PatentTitleYear

8,358,018'Resin sealing structure for electronic component and resin sealing method for electronic component'2013 7,387,229'Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore'2008 7,350,684'Apparatus and method for forming bump'2008 7,246,430'Electronic component mounting apparatus and electronic component mounting method'2007 6,910,613'Device and method for forming bump'2005 6,787,391'Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor'2004 6,619,535'Working method for holding a work object by suction'2003 6,568,580'Bump bonding apparatus and method'2003 6,527,905'Method for mounting electronic components and apparatus and dispenser used in the method'2003 6,494,358'Bump bonding apparatus and method'2002 6,481,616'Bump bonding device and bump bonding method'2002 6,392,202'Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer'2002 6,332,268'Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor'2001 6,328,196'Bump bonding device and bump bonding method'2001 6,329,640'Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer'2001 6,302,317'Bump bonding apparatus and method'2001 6,206,066'Apparatus for mounting an electronic component'2001 6,017,812'Bump bonding method and bump bonding apparatus'2000 5,899,375'Bump bonder with a discard bonding area'1999 5,899,140'Bump levelling method and bump levelling apparatus'1999 5,783,915'Linear actuating apparatus'1998 5,667,130'Ultrasonic wire bonding apparatus and method'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (21)· patent assignee history

1997–2007Based in Hirakata, JP· patent location history

1999–2008Based in Neyagawa, JP· patent location history

2001–2013Based in Osaka, JP· patent location history

2013Patents assigned to IMANISHI MAKOTO (1)· patent assignee history

2013Patents assigned to KUMAZAWA KENTARO (1)· patent assignee history

2013Patents assigned to PANASONIC CORP (1)· patent assignee history

2013Patents assigned to TOMURA YOSHIHIRO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	21	1997–2008
IMANISHI MAKOTOself	1	2013
KUMAZAWA KENTARO	1	2013
PANASONIC CORP	1	2013
TOMURA YOSHIHIRO	1	2013

Locations

Location	Patents	Span
Neyagawa, JP	16	1999–2008
Osaka, JP	3	2001–2013
Hirakata, JP	3	1997–2007