Inventor
SERGEY YUFEREV
Inventor
AT
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
G06FElectric digital data processing8%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
H03KPulse technique4%
PatentTitleYear
12,519,042Methods for manufacturing a semiconductor package and a semiconductor module202612,159,829Semiconductor package with non-uniformly distributed vias202412,094,807Stacked transistor chip package with source coupling202412,009,290Semiconductor module having a multi-branch switch node connector202411,978,692Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module202411,973,071Semiconductor module202411,935,874Circuitry and method of forming a circuitry202411,664,304Semiconductor module202311,444,017Semiconductor package and method of manufacturing a semiconductor package202211,348,861Semiconductor package and method of manufacturing a semiconductor package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (8)· patent assignee history
2022–2026Based in AT· patent location history
2024Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AUSTRIA AG | 8 | 2022–2026 |
| INFINEON TECHNOLOGIES AG | 2 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| AT | 10 | 2022–2026 |