Inventor
Daisaku Kugo
Inventor
Nagaokakyo, JP
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Hprimary
H03HImpedance networks, e.g. resonant circuits38%
Y10TTechnical subjects covered by former us classification33%
H05KPrinted circuits13%
B23PMetal-working not otherwise provided for8%
B25JManipulators4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
PatentTitleYear
6,315,577'Electronic component with lead and lead terminal'20016,046,529'Electronic component having structure for preventing separation at adhered portions'20005,942,836'Energy-trapping thickness-shear resonator and electronic components using the same'19995,727,301'Assembly system for assembling product comprising a plurality of parts'19985,724,724'Assembly system for assembling product comprising a plurality of parts'19985,709,024'Apparatus for assembling electronic component'19985,575,050'Method of assembling electronic component'19965,522,123'Method and apparatus for assembling electronic component'19965,507,087'Cover sheet assembling apparatus for electronic component'19965,487,580'Chuck unit'19965,299,681'Conveyor equipment'19945,259,911'Apparatus for automatically taping electronic components'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2001Patents assigned to MURATA MANUFACTURING CO (12)· patent assignee history
1993–1998Based in Nagaokakyo, JP· patent location history
1999–2001Based in Toyama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 12 | 1993–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagaokakyo, JP | 9 | 1993–1998 |
| Toyama, JP | 3 | 1999–2001 |