Inventor
DIEGO EDUARDO CARRASCO
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices27%
B23KSoldering or unsoldering7%
G01BMeasuring length, thickness or similar linear dimensions7%
G01RMeasuring electric variables7%
G06TImage data processing or generation, in general7%
H01RElectrically-conductive connections7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
12,542,389Reversible attachment micro connector202612,394,746Compression system calibration202512,300,529Alignment of targets on opposite sides of a substrate202512,278,212Reworkable inter-substrate bond structure202512,216,140Tilt calibration for probe systems202512,040,311Substrate debonding from bonded part2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to BOEING CO (6)· patent assignee history
2024–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BOEING CO | 6 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2024–2026 |