Inventor
Pei C. Chen
Inventor
Endicott, NY, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G11Bprimary
G11BInformation storage based on relative movement between record carrier and transducer15%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification15%
C23CCoating metallic material12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
B29CShaping or joining of plastics4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
C08JWorking-up4%
PatentTitleYear
7,846,305'Method and apparatus for increasing uniformity in ion mill process'20107,560,225'Method of forming uniform features using photoresist'20097,481,312'Direct cooling pallet assembly for temperature stability for deep ion mill etch process'20097,296,420'Direct cooling pallet tray for temperature stability for deep ion mill etch process'20076,532,134'Silicon coating on air bearing surface for magnetic thin film heads'20036,337,004'High adhesion performance roll sputtered strike layer'20026,235,411'Process for coating a substrate with metallic layer'20016,132,813'High density plasma surface modification for improving antiwetting properties'20006,117,283'Silicon coating on air bearing surface for magnetic thin film heads'20006,023,840'Method of manufacturing a thin film magnetic head having an ultrathin silicon wear coating'20005,943,187'Carbon overcoat for a slider with improved step coverage'19995,808,832'Ultrathin silicon wear coating for a slider and thin film magnetic head elements at an ABS'19985,525,369'Method for metallizing through holes in thin film substrates, and resulting devices'19965,461,203'Electronic package including lower water content polyimide film'19955,306,741'Method of laminating polyimide to thin sheet metal'19945,288,541'Method for metallizing through holes in thin film substrates, and resulting devices'19945,156,710'Method of laminating polyimide to thin sheet metal'19925,128,008'Method of forming a microelectronic package having a copper substrate'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2003Patents assigned to IBM (14)· patent assignee history
1992–2002Based in Endicott, NY, US· patent location history
1998–2003Based in Cupertino, CA, US· patent location history
2001Based in Endwell, NY, US· patent location history
2007–2009Patents assigned to HITACHI GLOBAL STORAGE TECH (3)· patent assignee history
2007–2010Based in Campbell, CA, US· patent location history
2009Based in San Jose, CA, US· patent location history
2010Patents assigned to HITACHI GLOBAL STORAGE TECH NL (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 14 | 1992–2003 |
| HITACHI GLOBAL STORAGE TECH | 3 | 2007–2009 |
| HITACHI GLOBAL STORAGE TECH NL | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 7 | 1992–2002 |
| Cupertino, California, US | 6 | 1998–2003 |
| Campbell, California, US | 3 | 2007–2010 |
| San Jose, California, US | 1 | 2009 |
| Endwell, New York, US | 1 | 2001 |